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公开(公告)号：US06327148B1
公开(公告)日：2001-12-04
申请号：US09606470
申请日：2000-06-29
IPC分类号： H05R720
CPC分类号： H05K7/1431 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are parallel to one another and orthogonal to the bottom of the base portion. The fins have a constant profile relative to the bottom of the base portion, but the base portion has a central portion that is thicker than its end portions. The thickness of the central portion varies according to a radius. The radius is approximated by step differences in the depths of the fins.
摘要翻译： 用于主动冷却子板系统的散热器。 多个横向翅片与基部一体地形成。 散热片彼此平行并且垂直于基部的底部。 翅片相对于基部的底部具有恒定的轮廓，但是基部具有比其端部部分更厚的中心部分。 中心部分的厚度根据半径而变化。 半径近似于翅片深度的阶差。
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公开(公告)号：US06304442B1
公开(公告)日：2001-10-16
申请号：US09607039
申请日：2000-06-29
IPC分类号： H05K720
CPC分类号： H05K7/1431 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An actively cooled daughterboard system. One more daughterboards are mounted in parallel rows on a motherboard. Each daughterboard is oriented substantially perpendicular to the motherboard, but may optionally be mounted at an oblique angle relative to the motherboard. Each daughterboard has a low-profile thermally-efficient heatsink mounted thereon. A fan shroud partially covers the daughterboards, but has openings in its sides for directing air flow through plural fins on the heatsinks and through a fan mounted to the top of the fan shroud. The inventive daughterboard system enables multiple high heat dissipating daughterboards to be placed closer together than the daughterboard systems of the prior art while still keeping the daughterboards adequately cooled. Moreover, because only a single fan is used to cool all of the daughterboards under the shroud, noise and expense are reduced relative to prior art systems that employed one or more fans per daughterboard.
摘要翻译： 主动冷却子板系统。 另外还有一个子板在主板上平行排列。 每个子板基本上垂直于母板定向，但是可以可选地以相对于母板的倾斜角度安装。 每个子板具有安装在其上的低剖面热效率散热器。 风扇罩部分地覆盖子板，但是在其侧面具有开口，用于引导空气流过散热器上的多个散热片并通过安装在风扇罩顶部的风扇。 本发明的子板系统使得多个高散热子板比现有技术的子板系统更靠近放置，同时仍保持子板充分冷却。 此外，由于仅使用单个风扇来冷却护罩下的所有子板，相对于采用每个子板的一个或多个风扇的现有技术系统，噪声和费用降低。
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公开(公告)号：US06295202B1
公开(公告)日：2001-09-25
申请号：US09606471
申请日：2000-06-29
IPC分类号： H05K720
CPC分类号： H01L23/467 , G06F1/20 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： A heatsink for use with an actively cooled daughterboard system. Plural transverse fins are integrally formed with a base portion. The fins are radially displaced from one another. The base portion includes a central portion that is thicker than the end portions. The thickness of the base portion and the profile formed by the outer ends of the fins vary according to radii. The inner radius associated with the central fins is shorter than the inner radius associated with the endmost fins.
摘要翻译： 用于主动冷却子板系统的散热器。 多个横向翅片与基部一体地形成。 翅片彼此径向偏移。 基部包括比端部部分厚的中心部分。 基部的厚度和由翅片的外端形成的轮廓根据半径而变化。 与中心翅片相关联的内半径比与最末端翅片相关联的内半径短。
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公开(公告)号：US06807057B2
公开(公告)日：2004-10-19
申请号：US10348875
申请日：2003-01-22
IPC分类号： H05K720
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for cooling an electronic device includes at least one angled flow control vane to divert a first airflow such that it blends with a second airflow that, prior to diversion of the first airflow, is substantially orthogonal to the first airflow. The efficient blending of the two airflows results in improved cooling of the electronic device.
摘要翻译： 用于冷却电子装置的装置包括至少一个成角度的流量控制叶片，以转移第一气流，使得其与第二气流共混，所述第二气流在第一气流转向之前基本上与第一气流正交。 两个气流的有效混合导致电子设备的改进的冷却。
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