公开(公告)号：US5496463A

公开(公告)日：1996-03-05

申请号：US350449

申请日：1994-12-07

申请人： Seiki Mori ,  Yasutoshi Ohtoh ,  Masaaki Beppu

发明人： Seiki Mori ,  Yasutoshi Ohtoh ,  Masaaki Beppu

IPC分类号： F02F1/00 ,  C25D5/08 ,  C25D7/04 ,  C25D15/00 ,  C25D15/02 ,  C25D17/00 ,  C25D17/12

CPC分类号： C25D15/02

摘要： In an electroplating container in which at least one portion of an inside surface of the container is formed from a metal material serving as cathode or anode and an anode or cathode is placed in the container, a composite electroplating liquid containing metal ions and fine solid particles is introduced into a bottom portion of the container in such a manner that the introduced composite electroplating liquid spouts downward against an inside bottom surface of the container and is allowed to flow upward through a flow path formed between the anode and the cathode, and an electric current is applied between the anode and cathode so as to form a composite electroplating layer including the fine solid particles evenly distributed in a metal matrix on a surface of the cathode or anode facing the flow path.

摘要翻译： 在其中容器的内表面的至少一部分由用作阴极或阳极的金属材料和阳极或阴极形成的电镀容器中放置在容器中，包含金属离子和细固体颗粒的复合电镀液 引入到容器的底部，使得引入的复合电镀液体向下突出抵靠容器的内底面，并且允许其通过形成在阳极和阴极之间的流路向上流动，并且电 在阳极和阴极之间施加电流，以便形成复合电镀层，该复合电镀层包括均匀分布在面向流路的阴极或阳极表面上的金属基质中的细固体颗粒。