公开(公告)号：US20130252173A1

公开(公告)日：2013-09-26

申请号：US13897861

申请日：2013-05-20

Applicant: Seiko Instruments Inc.

Inventor： Takashi NIWA ,  Matsuo KISHI ,  Koichiro JUJO ,  Hiroyuki HOSHINA

IPC: G03F7/00

CPC classification number: G03F7/0035 ,  C25D1/10 ,  C25D5/022

Abstract: In a method of manufacturing an electroforming mold, a first photoresist layer is formed on an upper surface of a bottom conductive film of a substrate, and the first photoresist layer is divided into a first soluble portion and a first insoluble portion. A conductive material is thermally deposited on an upper surface of the first photoresist layer within a predetermined temperature range, to thereby form an intermediate conductive film. An intermediate conductive film is patterned. A second photoresist layer is formed on an exposed upper surface of the first photoresist layer after the intermediate conductive film is removed, and on an upper surface of the intermediate conductive film remaining after patterning. The second photoresist layer is divided into a second soluble portion and a second insoluble portion. Next, the first and second photoresist layers are developed, and the first and second soluble portions are removed.

Abstract translation: 在电铸模具的制造方法中，在基板的底部导电膜的上表面上形成第一光致抗蚀剂层，将第一光致抗蚀剂层分割为第一可溶部分和第一不溶部分。 导电材料在预定温度范围内热沉积在第一光致抗蚀剂层的上表面上，从而形成中间导电膜。 对中间导电膜进行图案化。 在除去中间导电膜之后，在图案化之后残留的中间导电膜的上表面上，在第一光致抗蚀剂层的暴露的上表面上形成第二光致抗蚀剂层。 第二光致抗蚀剂层被分成第二可溶部分和第二不溶部分。 接下来，使第一和第二光致抗蚀剂层被显影，并且去除第一和第二可溶部分。