公开(公告)号：US09215361B2

公开(公告)日：2015-12-15

申请号：US14464630

申请日：2014-08-20

Applicant: Semiconductor Components Industries, LLC

Inventor： Swarnal Borthakur ,  Scott Churchwell ,  Rick Lake ,  Nathan Lee

IPC: H04N5/225 ,  H04N5/228

CPC classification number: H04N5/2258 ,  H04N5/2257

Abstract: An imaging system such as an array camera may include an array of image sensors. The image sensors may each include an array of image pixels formed in a common image sensor substrate. A protective glass cover layer may be provided over the array of image sensors. The cover layer may be attached to the image sensor substrate using an adhesive. The adhesive may be formed on the image sensor substrate in a grid-like pattern in between adjacent image sensors in the array. A light blocking material may be formed on the adhesive grid to minimize optical crosstalk between neighboring image sensors. The light blocking material may fill or partially fill a trench in the adhesive, may coat the outer surfaces of the adhesive, and/or may coat the inner surfaces of the adhesive. If desired, light barriers may also be formed in openings in the glass cover layer.

Abstract translation: 诸如阵列照相机的成像系统可以包括图像传感器阵列。 图像传感器可以各自包括形成在公共图像传感器基板中的图像像素的阵列。 可以在图像传感器阵列上方提供保护性玻璃覆盖层。 覆盖层可以使用粘合剂附着到图像传感器基底。 可以在图像传感器基板上以阵列中的相邻图像传感器之间的网格状图案形成粘合剂。 可以在粘合剂网格上形成遮光材料以最小化相邻图像传感器之间的光学串扰。 遮光材料可以填充或部分填充粘合剂中的沟槽，可以涂覆粘合剂的外表面和/或可以涂覆粘合剂的内表面。 如果需要，也可以在玻璃覆盖层的开口中形成光栅。

公开(公告)号：US20150281538A1

公开(公告)日：2015-10-01

申请号：US14225129

申请日：2014-03-25

Applicant: Semiconductor Components Industries, LLC

Inventor： Ulrich Boettiger ,  Swarnal Borthakur ,  Marc Sulfridge ,  Rick Lake

IPC: H04N5/225 ,  H04N9/097 ,  H04N5/232

CPC classification number: H04N5/2258 ,  H04N5/23232 ,  H04N5/23245 ,  H04N5/247

Abstract: An imaging system may include multiple imaging arrays. One or more of the arrays may be a low-power array that detects trigger events in observed scenes and, in response to the detection of a trigger event, activates one or more primary imaging arrays. One or more of the arrays may be a polarization sensing array, a hyperspectral array, a stacked photodiode array, a wavefront sensing array, a monochrome array, a single color array, a dual color array, or a full color array. In at least one embodiment, image data from a stacked photodiode imaging array may be enhanced using image data from a separate monochrome imaging array. In at least another embodiment, image data from a wavefront sensing array may provide focus detection for a full color array.

Abstract translation: 成像系统可以包括多个成像阵列。 一个或多个阵列可以是检测观察到的场景中的触发事件的低功率阵列，并且响应于触发事件的检测，激活一个或多个主要成像阵列。 一个或多个阵列可以是偏振感测阵列，高光谱阵列，堆叠光电二极管阵列，波阵面感测阵列，单色阵列，单色阵列，双色阵列或全色阵列。 在至少一个实施例中，可以使用来自单独的单色成像阵列的图像数据来增强来自堆叠的光电二极管成像阵列的图像数据。 在至少另一个实施例中，来自波前感测阵列的图像数据可以为全色阵列提供焦点检测。

公开(公告)号：US09041840B2

公开(公告)日：2015-05-26

申请号：US13972249

申请日：2013-08-21

Applicant: Semiconductor Components Industries, LLC

Inventor： Swarnal Borthakur ,  Scott Churchwell ,  Ulrich Boettiger ,  Marc Sulfridge ,  Andrew Perkins ,  Rick Lake

IPC: H04N5/335 ,  H04N5/225 ,  H01L27/146

CPC classification number: H04N5/335 ,  H01L27/14612 ,  H01L27/14616 ,  H01L27/14641 ,  H01L2224/16225 ,  H01L2224/73267 ,  H04N5/2253 ,  H04N5/2254

Abstract: An image sensor unit may have a backside-illuminated imager and an image co-processor stacked together. The image co-processor may be mounted in a cavity in a permanent carrier. The permanent carrier may include fluid channels that allow cooling fluid to flow past the image co-process and past the imager, thereby removing excess heat generated by the image sensor unit during operation.

Abstract translation: 图像传感器单元可以具有背面照射的成像器和图像协处理器堆叠在一起。 图像协处理器可以安装在永久载体中的空腔中。 永久性载体可以包括允许冷却流体流过图像协同处理并经过成像器的流体通道，从而在操作期间消除由图像传感器单元产生的多余的热量。