Method of fabricating a transistor in a semiconductor device
    1.
    发明授权
    Method of fabricating a transistor in a semiconductor device 失效
    在半导体器件中制造晶体管的方法

    公开(公告)号:US06569737B2

    公开(公告)日:2003-05-27

    申请号:US09818759

    申请日:2001-03-28

    IPC分类号: H01L21336

    CPC分类号: H01L29/66621 H01L21/76237

    摘要: Forming a semiconductor transistor by embedding the gate electrode into the substrate so that a step difference between the gate electrode and the source or drain region is reduced. Device isolation areas are defined by forming at least two first trenches having a first depth. The gate electrode is formed in a second trench located between the first trenches at a second depth being less than the first depth. A source and a drain are respectively formed between the gate electrode and the device isolation areas. The gate electrically connects the source and drain to form a semiconductor channel in the substrate.

    摘要翻译: 通过将栅电极嵌入衬底中形成半导体晶体管,使得栅电极和源极或漏极区之间的阶跃差减小。 通过形成具有第一深度的至少两个第一沟槽来限定器件隔离区域。 栅极电极形成在位于第一沟槽之间的第二沟槽中,第二沟槽的第二深度小于第一深度。 源极和漏极分别形成在栅电极和器件隔离区之间。 栅极电连接源极和漏极,以在衬底中形成半导体沟道。