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公开(公告)号:US10788094B2
公开(公告)日:2020-09-29
申请号:US15802621
申请日:2017-11-03
Applicant: SERCEL, INC.
Inventor: Matthew Cerniway , Michael Maples , Gaetan Mellier
Abstract: Method and dynamic vibration absorber device for reducing a resonant frequency of a node to which the dynamic vibration absorber device is attached to. The dynamic vibration absorber device includes a housing configured to be attached to the node; an absorber mass located inside the housing; and first and second diaphragms attached to the housing and configured to suspend the absorber mass inside the housing. The dynamic vibration absorber device changes a resonant frequency of the node to two smaller vibration peaks.
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公开(公告)号:US09909640B2
公开(公告)日:2018-03-06
申请号:US14509137
申请日:2014-10-08
Applicant: Sercel, Inc.
Inventor: Matthew Cerniway , Michael Maples , Gaetan Mellier
CPC classification number: F16F15/022 , B63B21/56 , G01V1/201 , G01V2001/205
Abstract: Method and apparatus for mitigating vibrations in a device towed in water. The apparatus includes one or more tuned elastic sections having a complex spring rate and adapted to attenuate vibrations in a specified frequency range; and a head end coupler adapted to couple the apparatus for vibration mitigation to a component of an electro-mechanical cable or a tow assembly. One of the one or more tuned elastic sections is coupled to the head end coupler with a high impedance material interface.
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公开(公告)号:US09869363B2
公开(公告)日:2018-01-16
申请号:US14509137
申请日:2014-10-08
Applicant: Sercel, Inc.
Inventor: Matthew Cerniway , Michael Maples , Gaetan Mellier
Abstract: Method and apparatus for mitigating vibrations in a device towed in water. The apparatus includes one or more tuned elastic sections having a complex spring rate and adapted to attenuate vibrations in a specified frequency range; and a head end coupler adapted to couple the apparatus for vibration mitigation to a component of an electro-mechanical cable or a tow assembly. One of the one or more tuned elastic sections is coupled to the head end coupler with a high impedance material interface.
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