Process for forming an anodized film over the surface of aluminum
substrates
    1.
    发明授权
    Process for forming an anodized film over the surface of aluminum substrates 失效
    在铝基板的表面上形成阳极氧化膜的工艺

    公开(公告)号:US4252620A

    公开(公告)日:1981-02-24

    申请号:US33174

    申请日:1979-04-25

    Applicant: Setsuo Tomita

    Inventor: Setsuo Tomita

    CPC classification number: C25D11/14

    Abstract: Anodized films having an aesthetic value are formed over the surface of aluminum or aluminum alloy substrates by anodizing the substrate in an electrolyte solution containing 50-60% of sulfuric acid and oxalic acid or nickel sulfate, at a bath temperature of 18.degree. to 30.degree. C. and a current density of 1 to 10 A/dm.sup.2.The oxide film formed by this method has a porcelain-like texture or feel or the appearance of a meshwork thereof or a grainy texture resembling wood, leather or sand, depending upon the nature of the base or substrate metal and the anodizing conditions employed.

    Abstract translation: 通过在含有50-60%硫酸和草酸或硫酸镍的电解质溶液中,在浴温为18°〜30°,对铝或铝合金基板表面进行阳极氧化,形成具有美学价值的阳极氧化膜。 并且电流密度为1至10A / dm 2。 通过该方法形成的氧化膜根据基底或基底金属的性质以及所使用的阳极氧化条件,具有类似瓷质的织构或手感或其网状物的外观或类似于木材,皮革或沙粒的纹理纹理。

    High speed aluminum anodizing
    2.
    发明授权
    High speed aluminum anodizing 失效
    高速铝阳极氧化

    公开(公告)号:US4225399A

    公开(公告)日:1980-09-30

    申请号:US33173

    申请日:1979-04-25

    Applicant: Setsuo Tomita

    Inventor: Setsuo Tomita

    CPC classification number: C25D11/08

    Abstract: Anodizing of aluminum or aluminum alloys at an exceptionally high film forming rate is conducted by the employment of a current density greater than 1.5 A/dm.sup.2 and a concentration of sulfuric acid of from 20% to 30% by weight in an electrolyte solution bath, and by the use of a racking device and cooling device which is designed for said severe conditions of current density and sulfuric acid concentration. A careful selection and regulation of the anodizing temperature enables the option of forming a soft or hard oxide film of greater thickness than achieved heretofore. Bath temperatures of around 30.degree. C. permit the formation of a soft oxide film, while bath temperatures of around 5.degree. C. permit the formation of a hard oxide film.

    Abstract translation: 通过在电解质溶液浴中使用大于1.5A / dm 2的电流密度和20%至30%重量的硫酸浓度来进行异常高的成膜速率的铝或铝合金的阳极氧化,以及 通过使用设计用于电流密度和硫酸浓度的严酷条件的货架装置和冷却装置。 仔细选择和调节阳极氧化温度使得可以选择形成比迄今为止实现的更厚的软或硬氧化物膜。 约30℃的浴温度允许形成软氧化物膜,而在约5℃的浴温度下允许形成硬氧化物膜。

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