公开(公告)号：US20060048807A1

公开(公告)日：2006-03-09

申请号：US11223284

申请日：2005-09-08

申请人： Seung-Min Lee ,  Jeong-Il Kye

发明人： Seung-Min Lee ,  Jeong-Il Kye

IPC分类号： H01L35/30 ,  H01L35/28

CPC分类号： H01L35/32

摘要： Disclosed herein is a thin film thermoelectric module. the module includes high and low temperature part module substrates, unit thermoelectric devices, and lead wires. The high and low temperature part module substrates are arranged to face each other. The unit thermoelectric devices are located between the modules to transfer heat between the modules. The lead wires are connected to the electrodes of the unit thermoelectric devices. Each of the unit thermoelectric devices includes a pair of lower and upper substrates, electrodes, and a thermoelectric material. The pair of lower and upper substrates are arranged to face each other. The electrodes are formed on the upper surface of the lower substrate and the lower surface of the upper substrate. The thermoelectric material is disposed between the electrodes.

摘要翻译： 这里公开了一种薄膜热电模块。 该模块包括高低温部件模块基板，单元热电装置和引线。 高低温部件模块基板被布置成彼此面对。 单元热电装置位于模块之间，以在模块之间传递热量。 引线连接到单元热电装置的电极。 每个单元热电装置包括一对下基板和上基板，电极和热电材料。 一对下基板和上基板布置成彼此面对。 电极形成在下基板的上表面和上基板的下表面上。 热电材料设置在电极之间。