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公开(公告)号:US10699650B1
公开(公告)日:2020-06-30
申请号:US16441668
申请日:2019-06-14
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
IPC: G09G3/34
Abstract: A driving method for an electrowetting panel is provided. The electrowetting panel includes M driving electrodes sequentially arranged along a first direction. The driving method includes providing electrical signals to the M driving electrodes, such that a droplet is acquired from a solution reservoir by the 1st driving electrode, and is driven to move by the M driving electrodes. During a droplet moving period, a pulse width of a driving signal of an mth driving electrode is Wm = ∑ i = 1 m W i , a pulse width of a non-driving signal between an ath driving signal and an (a+1)th driving signal of the mth driving electrode is Zma = ∑ i = m + 1 m + a W i . M, m, and a are positive integers, 1≤m≤M, and M≥3. The end time of the 1st driving signal of the mth driving electrode and the end time of the mth driving signal of the 1st driving electrode are the same.
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公开(公告)号:US11257765B2
公开(公告)日:2022-02-22
申请号:US16441501
申请日:2019-06-14
Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
IPC: H01L23/538 , H01L21/48 , H01L21/56 , H01L23/31 , H01L23/00
Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a redistribution layer, a soldering pad group, and bare chips. Connecting posts is formed on a side of the bare chips. The encapsulating layer covers the bare chips and the connecting posts, while exposes a side of the connecting posts away from the bare chips. The redistribution layer on the connecting posts includes a first redistribution wire, a second redistribution wire, and a third redistribution wire. The first redistribution wire and the second redistribution wire are electrically connected to at least one connecting post respectively, and the third redistribution layer is electrically connected to remaining connecting posts. The soldering pad group on the redistribution layer includes an input soldering pad electrically connected to the first redistribution wire and an output soldering pad electrically connected to the second redistribution wire.
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