公开(公告)号：US20190064987A1

公开(公告)日：2019-02-28

申请号：US15922684

申请日：2018-03-15

Applicant: Shanghai Tianma Micro-Electronics Co.,Ltd.

Inventor： Feng LU ,  Takatori KENICHI

IPC: G06F3/041 ,  H01L27/32 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1362

Abstract: The present disclosure relates to the field of display technologies and provides a display panel and a display device, for lowering the risk of the force-sensing sensor being damaged by the electrostatic breakdown during the manufacture of the display panel. The display panel includes a force-sensing sensor and first to fourth input signal lines connected to the pressure-sensing sensor. At least one of the first input signal line, the second input signal line, the first output signal line and the second output signal line is a bridge. The bridge includes a first connection line connected to the force-sensing sensor and located in a first conduction layer, a second connection line located in a second conduction layer and connected to the first connection line through a first through-hole, a third connection line located in the first conduction layer and connected to the second connection line through a second through-hole.

公开(公告)号：US20190064986A1

公开(公告)日：2019-02-28

申请号：US15920292

申请日：2018-03-13

Applicant: Shanghai Tianma Micro-Electronics Co.,Ltd.

Inventor： Feng LU ,  Haga HIROSHI ,  Takatori KENICHI ,  Yingteng ZHAI

IPC: G06F3/041 ,  G09G3/36

Abstract: A display panel and a display device reduces the adverse effects on touch function and display function caused by high heat generation of a force-sensing sensor. The display panel includes, in part, a force sensing sensor, an amplification circuit and a drive chip. The force-sensing sensor includes a first input, a second input, a first output and a second output. The amplification circuit is associated with the force-sensing sensor and includes a first amplification input, a second amplification input and at least one amplification output, wherein the first amplification input of the amplification circuit is coupled to the first output of the force-sensing sensor and the second amplification input of the amplification circuit is coupled to the second output of the force-sensing sensor. The drive chip is coupled to the amplification output of the amplification circuit.