Wafer Tilt Detection Apparatus and Method
    2.
    发明申请
    Wafer Tilt Detection Apparatus and Method 失效
    晶圆倾斜检测装置及方法

    公开(公告)号:US20070269910A1

    公开(公告)日:2007-11-22

    申请号:US11749611

    申请日:2007-05-16

    IPC分类号: H01L21/66

    CPC分类号: H01L22/26

    摘要: An exemplary embodiment providing one or more improvements includes a wafer tilt detection apparatus for use with a wafer processing or manufacturing device that applies a process to the wafer and which utilizes an endpoint signal for determining control of the process applied to the wafer. The wafer tilt apparatus uses the endpoint signal in establishing when the wafer was in a tilted orientation during processing.

    摘要翻译: 提供一个或多个改进的示例性实施例包括与晶片处理或制造装置一起使用的晶片倾斜检测装置,该晶片处理或制造装置向晶片施加过程,并且利用端点信号来确定施加到晶片的工艺的控制。 晶片倾斜装置在处理期间当晶片处于倾斜取向时,使用端点信号建立。

    Wafer tilt detection apparatus and method
    3.
    发明授权
    Wafer tilt detection apparatus and method 失效
    晶圆倾斜检测装置及方法

    公开(公告)号:US07561258B2

    公开(公告)日:2009-07-14

    申请号:US11749611

    申请日:2007-05-16

    IPC分类号: H01L21/66 G01J3/443

    CPC分类号: H01L22/26

    摘要: An exemplary embodiment providing one or more improvements includes a wafer tilt detection apparatus for use with a wafer processing or manufacturing device that applies a process to the wafer and which utilizes an endpoint signal for determining control of the process applied to the wafer. The wafer tilt apparatus uses the endpoint signal in establishing when the wafer was in a tilted orientation during processing.

    摘要翻译: 提供一个或多个改进的示例性实施例包括与晶片处理或制造装置一起使用的晶片倾斜检测装置,该晶片处理或制造装置向晶片施加过程,并且利用端点信号来确定施加到晶片的工艺的控制。 晶片倾斜装置在处理期间当晶片处于倾斜取向时,使用端点信号建立。