公开(公告)号：US10186525B2

公开(公告)日：2019-01-22

申请号：US15422546

申请日：2017-02-02

申请人： Sharp Kabushiki Kaisha

发明人： Yuichi Saito ,  Yohsuke Kanzaki ,  Yudai Takanishi ,  Tetsuya Okamoto ,  Yoshiki Nakatani ,  Yoshimasa Chikama

IPC分类号： H01L21/44 ,  H01L27/12 ,  H01L21/3213 ,  H01L23/532 ,  H01L29/66 ,  H01L29/786 ,  H01L21/465 ,  H01L21/4763 ,  H01L29/24 ,  H01L29/45 ,  H01L21/02 ,  G02F1/1343 ,  G02F1/1362 ,  G02F1/1333 ,  G02F1/1368

摘要： The present invention provides a circuit board having excellent productivity, particularly a circuit board having excellent productivity with respect to a semiconductor layer and source layer forming step, a display device, and a process for producing a circuit board. The circuit board of the present invention is a circuit board including an oxide semiconductor layer and an electrode connected to the oxide semiconductor layer, wherein the electrode is formed by essentially laminating a layer made of a metal other than copper and a layer containing copper.