Optical film assembly, backlight module and display device

    公开(公告)号:US10359559B2

    公开(公告)日:2019-07-23

    申请号:US15558182

    申请日:2017-07-14

    IPC分类号: F21V8/00 G02F1/13357 G02B5/02

    摘要: The invention provides an optical film assembly, a backlight module, and a display device. The backlight module includes a light source emitting at least a first light, a first optical film, and a second optical film laminated to the first optical film, wherein the first optical film includes a functional layer but does not include a base film, the functional layer is a diffusion film, a brightness enhancement film, a reflection film, or a prism film, and the second optical film is a light conversion layer, the light conversion layer receives the first light and converts the first light to at least a second light to emit, such that a light emission angle of the backlight module matches a requirement of wide viewing angle. The invention could broaden the light emitting angle of the backlight module to make the display device with the backlight module achieve wide viewing angle.

    Backlight module and a display device

    公开(公告)号:US10591776B2

    公开(公告)日:2020-03-17

    申请号:US15558185

    申请日:2017-07-18

    IPC分类号: G02F1/1335 F21V8/00 B29D11/00

    摘要: The present application discloses a backlight module and a display device, the backlight module including a light source for emitting at least a first light; at least two sheets of light conversion films, wherein at least one sheet of light conversion films receives the first light and converts the light into at least a second light to emit, and makes the light emitting angle of the backlight module matching the wide viewing angle display requirements. It can increase the light emitting angle of the backlight module and achieve the wide viewing angle effect. By having at least two sheets of light conversion films at the same time, a part of the light is reflected back while the light is scattered and emitted at the same time, and the light is excited and emitted again, to improve the light utilization rate, enhance the brightness to have a better performance of display.

    Optical film assembly, backlight module and display device

    公开(公告)号:US10527774B2

    公开(公告)日:2020-01-07

    申请号:US15558170

    申请日:2017-07-17

    摘要: The invention provides an optical film assembly, a backlight module, and a display device. The backlight module includes a light source emitting at least a first light, a first optical film, and a second optical film laminated to the first optical film, wherein the first optical film includes a base film and a functional layer stacking up to the base film, the functional layer is a diffusion film, a brightness enhancement film, a reflection film, or a prism film, the second optical film is a light conversion layer, the light conversion layer receives the first light and converts the first light to a second light to emit, such that a light emission angle of the backlight module matches a requirement of wide viewing angle. The invention could broaden the light emitting angle of the backlight module to make the display device with the backlight module achieve wide viewing angle.

    Micro light-emitting diode display panel and manufacturing method

    公开(公告)号:US10089908B2

    公开(公告)日:2018-10-02

    申请号:US15515146

    申请日:2017-03-07

    摘要: The disclosure provides a micro light-emitting diode display panel. The array substrate is arranged with a plurality of pixels in an array. Each of the pixels at least includes a subpixel of three colors. Each of the subpixels is disposed with at least one μLED chip corresponding to color of the subpixel. Bin levels of the μLED chips of the subpixels with the same color in two adjacent pixels are different and a difference of peak wavelengths >2 nm. The disclosure further provides a manufacturing method, the μLED chips with the corresponding color in the subpixel of the array substrate are transfer printed from the transfer printing plate to corresponding subpixels. The color and the bin level of the μLED chips in each transfer printing are identical. Bin levels of the μLED chips in the sub-pixels with the same color in two adjacent pixels are different.