公开(公告)号：US20070015010A1

公开(公告)日：2007-01-18

申请号：US11481249

申请日：2006-07-06

申请人： Shigeru Horigome ,  Takashi Arai

发明人： Shigeru Horigome ,  Takashi Arai

IPC分类号： G11B5/64 ,  C23C14/00

CPC分类号： G11B5/7325 ,  C23C14/50 ,  C23C14/568 ,  G11B5/84 ,  G11B5/8408 ,  G11B5/851

摘要： In a step of forming the under layer, the under layer is formed while an insulating substrate is supported by support members made of a conductive material. In a step of forming a recording layer, the insulating substrate remains supported. A movable electrode is urged into contact with an end face of the insulating substrate. The recording layer is formed by a sputtering process while a negative bias voltage is applied. Since the under layer is formed on the end face of the substrate, the electric conduction between the movable electrode and the under layer is good. Moreover, the under layer formed on the surface of the substrate is bridged to a part of a contact section of the support springs. Therefore, the support springs and the under layer is electrically connected. A bias voltage is applied to the under layer through the movable electrode and the support springs.

摘要翻译： 在形成底层的步骤中，形成底层，同时绝缘基板由由导电材料制成的支撑构件支撑。 在形成记录层的步骤中，绝缘衬底保持支撑。 可动电极被迫与绝缘基板的端面接触。 记录层通过溅射工艺形成，同时施加负偏置电压。 由于底层形成在基板的端面上，所以可动电极和下层之间的导电性良好。 此外，形成在基板的表面上的下层桥接到支撑弹簧的接触部分的一部分。 因此，支撑弹簧和下层电连接。 偏压通过可动电极和支撑弹簧施加到下层。

公开(公告)号：US20060154111A1

公开(公告)日：2006-07-13

申请号：US11126337

申请日：2005-05-11

申请人： Shigeru Horigome ,  Takashi Arai

发明人： Shigeru Horigome ,  Takashi Arai

IPC分类号： G11B5/64 ,  C23C14/00

CPC分类号： C23C14/345 ,  C23C14/025 ,  C23C14/14 ,  C23C14/50 ,  G11B5/8404 ,  G11B5/851

摘要： In a step of forming the under layer, the under layer is formed while an insulating substrate is supported by support members made of a conductive material. In a step of forming a recording layer, the insulating substrate remains supported. A movable electrode is urged into contact with an end face of the insulating substrate. The recording layer is formed by a sputtering process while a negative bias voltage is applied. Since the under layer is formed on the end face of the substrate, the electric conduction between the movable electrode and the under layer is good. Moreover, the under layer formed on the surface of the substrate is bridged to a part of a contact section of the support springs. Therefore, the support springs and the under layer is electrically connected. A bias voltage is applied to the under layer through the movable electrode and the support springs.

摘要翻译： 在形成底层的步骤中，形成底层，同时绝缘基板由由导电材料制成的支撑构件支撑。 在形成记录层的步骤中，绝缘衬底保持支撑。 可动电极被迫与绝缘基板的端面接触。 记录层通过溅射工艺形成，同时施加负偏置电压。 由于底层形成在基板的端面上，所以可动电极和下层之间的导电性良好。 此外，形成在基板的表面上的下层桥接到支撑弹簧的接触部分的一部分。 因此，支撑弹簧和下层电连接。 偏压通过可动电极和支撑弹簧施加到下层。

公开(公告)号：US20100116645A1

公开(公告)日：2010-05-13

申请号：US12593250

申请日：2007-03-27

申请人： Yoichi Sato ,  Shigeru Horigome ,  Satoshi Takiguchi ,  Yasutake Takamatsu ,  Katsunori Takahashi

发明人： Yoichi Sato ,  Shigeru Horigome ,  Satoshi Takiguchi ,  Yasutake Takamatsu ,  Katsunori Takahashi

IPC分类号： C23C14/40

CPC分类号： G11B5/8404

摘要： A surface processing method of processing a surface of a substrate includes disposing the substrate in a vacuum chamber, processing by applying a high-frequency voltage to the substrate and by sputtering the surface of the substrate, measuring a cathode drop potential generated at the substrate in the processing and obtaining a time integration value of the cathode drop potential, and determining whether or not a processed state of the surface of the substrate is good based on the time integration value obtained in the measuring.

摘要翻译： 处理基板表面的表面处理方法包括将基板设置在真空室中，通过向基板施加高频电压，通过溅射基板的表面进行处理，测定基板上产生的阴极液滴电位 处理并获得阴极滴下电位的时间积分值，并且基于在测量中获得的时间积分值来确定衬底的表面的处理状态是否良好。