Substrate processing apparatus and substrate processing method
    1.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号:US06251189B1

    公开(公告)日:2001-06-26

    申请号:US09502219

    申请日:2000-02-11

    IPC分类号: C23C1600

    摘要: The present invention is constituted so as to improve a quartz gas supply portion utilized in a normal pressure furnace, and to keep to a minimum the damage incurred by a normal pressure furnace by the shock from an earthquake. Quartz gas supply piping 25 for supplying a reactant gas is connected to a quartz reaction tube 4, which constitutes a furnace body. A stress concentration portion 23 for concentrating stress by prioritizing another location when vibration occurs in a furnace body is formed on this gas supply piping 25. The stress concentration portion 23 is disposed on the side of a source-side gas supply pipe 8, which is in front of a pipe clamp 21 that connects the source-side gas supply pipe 8 to a reaction tube-side gas supply pipe 7 mounted to the reaction tube 4. As a stress concentration portion 23, the simplest of V-grooves can be formed in the circumferential direction.

    摘要翻译: 本发明构成为改善在常压炉中使用的石英气体供给部,并且通过来自地震的冲击使至少由常压炉引起的损坏保持在最低限度。 用于供给反应气体的石英气体供给配管25与构成炉体的石英反应管4连接。 在该气体供给配管25上形成有用于在炉体中发生振动时将其它位置优先排列的应力集中部23。应力集中部23配置在源侧气体供给管8的一侧 在连接源侧气体供给管8与安装在反应管4上的反应管侧气体供给管7的管夹21的前方。作为应力集中部23,可以形成最简单的V形槽 在圆周方向。