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公开(公告)号：US08376562B2
公开(公告)日：2013-02-19
申请号：US12886123
申请日：2010-09-20
IPC分类号： F21V33/00
CPC分类号： F21V3/00 , F21K9/23 , F21V3/061 , F21V3/062 , F21V17/101 , F21V19/0055 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： A light-emitting module includes a module substrate, semiconductor light-emitting elements and a connection substrate. On one face of the module substrate, a conductive layer is formed. The semiconductor light-emitting elements and the connection substrate are mounted on the conductive layer of the module substrate. Electric wires, which extend from a lighting circuit, are connected to the connection substrate. Power is supplied to the semiconductor light-emitting elements through the connection substrate and the conductive layer of the module substrate.
摘要翻译： 发光模块包括模块基板，半导体发光元件和连接基板。 在模块基板的一个面上形成导电层。 半导体发光元件和连接基板安装在模块基板的导电层上。 从照明电路延伸的电线连接到连接基板。 通过连接基板和模块基板的导电层向半导体发光元件供电。
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公开(公告)号：US20110074291A1
公开(公告)日：2011-03-31
申请号：US12886123
申请日：2010-09-20
CPC分类号： F21V3/00 , F21K9/23 , F21V3/061 , F21V3/062 , F21V17/101 , F21V19/0055 , F21V23/002 , F21V29/773 , F21Y2115/10
摘要： A light-emitting module includes a module substrate, semiconductor light-emitting elements and a connection substrate. On one face of the module substrate, a conductive layer is formed. The semiconductor light-emitting elements and the connection substrate are mounted on the conductive layer of the module substrate. Electric wires, which extend from a lighting circuit, are connected to the connection substrate. Power is supplied to the semiconductor light-emitting elements through the connection substrate and the conductive layer of the module substrate.
摘要翻译： 发光模块包括模块基板，半导体发光元件和连接基板。 在模块基板的一个面上形成导电层。 半导体发光元件和连接基板安装在模块基板的导电层上。 从照明电路延伸的电线连接到连接基板。 通过连接基板和模块基板的导电层向半导体发光元件供电。
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公开(公告)号：US20140169004A1
公开(公告)日：2014-06-19
申请号：US14239451
申请日：2011-09-27
申请人： Hiromichi Nakajima , Shinichiro Matsumoto , Masahiko Kamata , Yuichiro Takahara , Hiroshi Matsushita , Shinichi Kumashiro , Shigeru Osawa
发明人： Hiromichi Nakajima , Shinichiro Matsumoto , Masahiko Kamata , Yuichiro Takahara , Hiroshi Matsushita , Shinichi Kumashiro , Shigeru Osawa
IPC分类号： F21V29/00
CPC分类号： F21V29/507 , F21K9/20 , F21K9/68 , F21S8/026 , F21V23/0442 , F21V29/70 , F21Y2115/10
摘要： A lamp device includes a semiconductor light-emitting element. The lamp device includes a housing including a heat conductive part, and the heat conductive part is thermally connected to an external thermal radiator. Heat generated by the semiconductor light-emitting element is conducted to the thermal radiator through the heat conductive part. A thermosensor is thermally connected to the heat conductive part. The lamp device includes a lighting circuit to light the semiconductor light-emitting element, and the lighting circuit controls an output of the semiconductor light-emitting element according to detection of the thermosensor.
摘要翻译： 灯装置包括半导体发光元件。 灯装置包括：壳体，包括导热部分，并且热传导部分热连接到外部散热器。 由半导体发光元件产生的热量通过导热部件传导到散热器。 热传感器热连接到导热部分。 灯装置包括点亮电路以点亮半导体发光元件，并且点亮电路根据热敏传感器的检测来控制半导体发光元件的输出。
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公开(公告)号：US20130083549A1
公开(公告)日：2013-04-04
申请号：US13598150
申请日：2012-08-29
申请人： Yuichiro Takahara , Masahiko Kamata , Hiroshi Matsushita , Hiromichi Nakajima , Shigeru Osawa , Shinichiro Matsumoto
发明人： Yuichiro Takahara , Masahiko Kamata , Hiroshi Matsushita , Hiromichi Nakajima , Shigeru Osawa , Shinichiro Matsumoto
IPC分类号： F21V29/00
CPC分类号： F21S8/026 , F21V15/01 , F21V23/005 , F21V29/70 , F21V29/713 , F21V29/89 , F21Y2115/10
摘要： According to one embodiment, the device main body includes a main body portion, a protruding portion, and a heat conducting portion. The main body portion has an opening on one end side and has a wall portion on the other end side that is opposite to the opening side. The protruding portion protrudes from the wall portion and an inside thereof continues into the main body portion. The heat conducting portion has one end side thereof protruding from the wall portion toward the opening and has the other end side thereof connected to the protruding portion in a way that enables heat conduction. The light emitting unit is connected to the one end side of the heat conducting portion in a way that enables heat conduction. The lighting unit is housed inside the device main body and a portion of the lighting circuit component is arranged inside the protruding portion.
摘要翻译： 根据一个实施例，装置主体包括主体部分，突出部分和导热部分。 主体部在一端侧具有开口部，在与开口侧相反的另一端侧具有壁部。 突出部从壁部突出，其内部延伸到主体部。 导热部的一端侧从壁部向开口突出，另一端侧以突出部与导热部连接。 发光单元以能够进行热传导的方式连接到导热部分的一端侧。 照明单元容纳在设备主体内部，并且照明电路部件的一部分布置在突出部分的内部。
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公开(公告)号：US08540396B2
公开(公告)日：2013-09-24
申请号：US13597992
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译： 能够有效地散发灯装置的热量的照明器具可以被构造成附接到插座装置。 在一些示例中，通过将灯装置附接到插座装置，灯装置的盖部与夹具本体接触，并通过弹性体抵压并与夹具本体紧密接触。 通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。
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公开(公告)号：US20120320611A1
公开(公告)日：2012-12-20
申请号：US13597953
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
摘要翻译： 能够有效地散发灯装置的热量的照明器具可以被构造成附接到插座装置。 在一些示例中，通过将灯装置附接到插座装置，灯装置的盖部与夹具本体接触，并通过弹性体抵压并与夹具本体紧密接触。 通过灯装置的LED的照明而产生的热量从帽部传导到夹具本体并被有效地辐射。
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公开(公告)号：USD662479S1
公开(公告)日：2012-06-26
申请号：US29398861
申请日：2011-08-05
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公开(公告)号：US08434908B2
公开(公告)日：2013-05-07
申请号：US13597953
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
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公开(公告)号：US08613529B2
公开(公告)日：2013-12-24
申请号：US13119519
申请日：2009-11-16
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： There is provided a lighting fixture 11 capable of efficiently radiating heat of a lamp device 14 attached to a socket device 13. By attaching the lamp device 14 to the socket device 13, a cap portion 38 of the lamp device is brought into contact with a fixture body 12, and pressed against and brought into contact with the fixture body 12 by an elastic body 30. Heat generated by lighting of LEDs 35 of the lamp device 14 is conducted from the cap portion 38 to the fixture body 12 and efficiently radiated.
摘要翻译： 提供了能够有效地散发安装在插座装置13上的灯装置14的热量的照明器具11.通过将灯装置14安装到插座装置13，使灯装置的盖部38与 夹具本体12，并通过弹性体30压靠固定主体12.与灯装置14的LED35的照明产生的热量从盖部38向夹具本体12传导并有效地照射。
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公开(公告)号：US08540399B2
公开(公告)日：2013-09-24
申请号：US13597804
申请日：2012-08-29
申请人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
发明人： Satoshi Watanabe , Keiichi Shimizu , Takeshi Osada , Keiichi Shimizu , Toshiya Tanaka , Shigeru Osawa , Takeshi Hisayasu , Hirokazu Otake , Hitoshi Kawano , Makoto Sakai
IPC分类号： F21V29/00
CPC分类号： F21V29/004 , F21K9/20 , F21V19/001 , F21V19/006 , F21V29/67 , F21V29/73 , F21V29/74 , F21Y2115/10 , H01R33/9456 , Y10T29/49879
摘要： A lighting fixture capable of efficiently radiating heat of a lamp device may be configured to be attached to a socket device. In some examples, by attaching the lamp device to the socket device, a cap portion of the lamp device is brought into contact with a fixture body, and pressed against and brought into close contact with the fixture body by an elastic body. Heat generated by lighting of LEDs of the lamp device is conducted from the cap portion to the fixture body and efficiently radiated.
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