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    Cooling structure for electronic devices
    1.
    发明授权
    Cooling structure for electronic devices 有权
    电子设备冷却结构

    公开(公告)号：US07046513B2

    公开(公告)日：2006-05-16

    申请号：US10719821

    申请日：2003-11-20

    申请人： Shinichi Nishiyama ,  Yasuji Morishita ,  Yasuyuki Katakura ,  Youji Okabe ,  Tadaharu Maeda

    发明人： Shinichi Nishiyama ,  Yasuji Morishita ,  Yasuyuki Katakura ,  Youji Okabe ,  Tadaharu Maeda

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20572

    摘要： A cooling structure for electronic devices includes a plurality of electronic device accommodating boxes, in which electronic devices are accommodated, disposed in a casing in multiple stages. A vent portion which allows ventilation between the inside and the outside of the casing is formed in a ceiling of the casing. In a first accommodating portion for accommodating the first electronic device accommodating box which is defined at the stage close to the ceiling, a hollow duct having two opening faces is arranged. The first opening face faces the vent portion and the second opening face faces a second accommodating portion for accommodating the second electronic device accommodating box which is defined at the stage remote from the ceiling. Air inside the second electronic device accommodating box is discharged through the inside of the duct. Air inside of the first electronic device accommodating box is discharged from the vent portion.

    摘要翻译： 电子设备的冷却结构包括容纳电子设备的多个电子设备容纳盒，多个阶段设置在壳体中。 在壳体的天花板上形成有允许壳体内外的通气的排气部。 在用于容纳限定在靠近天花板的台阶处的第一电子装置收纳盒的第一容纳部中，配置有具有两个开口面的中空管。 第一开口面朝向通气部分，第二开口面面向第二容纳部分，用于容纳限定在远离天花板的台阶处的第二电子装置容纳盒。 第二电子装置收纳箱内的空气通过管道内部排出。 第一电子装置收纳盒内的空气从通气部排出。