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1.
公开(公告)号:US20230234333A1
公开(公告)日:2023-07-27
申请号:US17926362
申请日:2021-06-08
CPC分类号: B32B7/12 , C09J9/02 , C09J7/38 , B32B27/18 , H05K3/20 , H05K1/09 , B32B2307/7376 , B32B2457/08 , B32B27/281
摘要: Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection includes a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. A thickness of the first adhesive layer is 5 μm or less.
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公开(公告)号:US20210292643A1
公开(公告)日:2021-09-23
申请号:US17340543
申请日:2021-06-07
发明人: Kouhei MUKAIGAITO , Shigeaki FUNYU , Hiroaki TAKAHASHI , Tomoyuki NAKAMURA , Masato FUKUI , Takanori KAJIMOTO , Yoshitaka KATSUTA , Tatsuya YAHATA
摘要: Provided are a wavelength conversion member including: a quantum dot phosphor; a white pigment including an organic substance layer that contains an organic substance, on at least a part of a surface of the white pigment; and a resin cured product including the quantum dot phosphor and the white pigment.
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