公开(公告)号：US20140295013A1

公开(公告)日：2014-10-02

申请号：US14305034

申请日：2014-06-16

申请人： Shu Chuen HO ,  Si Liang LU ,  Swee Kwong MOK ,  Kar Weng YAN

发明人： Shu Chuen HO ,  Si Liang LU ,  Swee Kwong MOK ,  Kar Weng YAN

IPC分类号： B29C33/44

CPC分类号： B29C33/442 ,  B29C45/14655 ,  B29C45/372

摘要： A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

摘要翻译： 一种用于电子设备的成型设备包括第一模具追逐，第二模具追逐和中间板，其构造成在模制期间与第一模具追逐和第二模具追逐之间的电子装置夹紧在一起。 形成在中间板中的模腔构造成用于接收模塑料。 封装销安装在中间板上以与中间板一起移动，并且封装销的一部分定位成突出到模制腔中以在模制化合物中形成标记，当模制化合物围绕所述模制化合物的所述部分 封装引脚。

公开(公告)号：US20110210477A1

公开(公告)日：2011-09-01

申请号：US13036074

申请日：2011-02-28

申请人： Shu Chuen HO ,  Si Liang LU ,  Swee Kwong MOK ,  Kar Weng YAN

发明人： Shu Chuen HO ,  Si Liang LU ,  Swee Kwong MOK ,  Kar Weng YAN

IPC分类号： B29C45/14 ,  B29C45/02

CPC分类号： B29C33/442 ,  B29C45/14655 ,  B29C45/372

摘要： A molding apparatus for an electronic device comprises a first mold chase, a second mold chase and a middle plate which is configured to be clamped together with the electronic device between the first mold chase and second mold chase during molding. A molding cavity formed in the middle plate is configured for receiving molding compound. A package pin is mounted on the middle plate to be movable with the middle plate, and a portion of the package pin is positioned to protrude into the molding cavity to form a mark in the molding compound when molding compound is molded around the said portion of the package pin.

摘要翻译： 一种用于电子设备的成型设备包括第一模具追逐，第二模具追逐和中间板，其构造成在模制期间与第一模具追逐和第二模具追逐之间的电子装置夹紧在一起。 形成在中间板中的模腔构造成用于接收模塑料。 封装销安装在中间板上以与中间板一起移动，并且封装销的一部分定位成突出到模制腔中以在模制化合物中形成标记，当模制化合物围绕所述模制化合物的所述部分 封装引脚。

公开(公告)号：US20110212214A1

公开(公告)日：2011-09-01

申请号：US13036078

申请日：2011-02-28

申请人： Shu Chuen HO ,  Si Liang LU ,  Swee Kwong MOK ,  Kar Weng YAN

发明人： Shu Chuen HO ,  Si Liang LU ,  Swee Kwong MOK ,  Kar Weng YAN

IPC分类号： B29C45/03

CPC分类号： B29C45/27 ,  B29C45/02 ,  B29C45/14655

摘要： A runner system for a molding apparatus comprises a plurality of runner networks, each runner network further comprising a mold supply pot having a first side and a second side opposite to the first side. A plurality of molding cavities are located on the first and second sides of the mold supply pot, and a plurality of runners are operative to channel molding compound from each mold supply pot to the plurality of molding cavities. At least one of the mold supply pots comprises a different number of runners located on the first side which are connected to the mold supply pot as compared to a number of runners located on the second side which are connected to the mold supply pot.

摘要翻译： 用于成型设备的流道系统包括多个流道网络，每个流道网络还包括具有第一侧和与第一侧相对的第二侧的模具供应罐。 多个模腔位于模具供应罐的第一和第二侧上，并且多个浇道可操作以将模塑料从每个模具供应罐引导到多个模腔。 与连接到模具供应罐的位于第二侧的多个浇道相比，至少一个模具供应罐包括位于第一侧上的不同数量的流道，其连接到模具供应罐。