公开(公告)号：US4410469A

公开(公告)日：1983-10-18

申请号：US325486

申请日：1981-11-27

申请人： Shuhei Katagiri ,  Kenichi Donuma ,  Makoto Ohashi

发明人： Shuhei Katagiri ,  Kenichi Donuma ,  Makoto Ohashi

IPC分类号： G02B6/42 ,  H01L33/48 ,  G02B5/174

CPC分类号： G02B6/4292 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/3025 ,  H01L33/483 ,  Y10S359/90

摘要： In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which have a common central axis and one of which defines an optical path of the module, in such a manner that the optoelectronic element is located on a central axis of the circuit module. Under this condition, the circuit module is housed in a cavity defined by a pair of second dies. A light-shielding molding material is injected into the cavity for injection molding to mold a case. After the case is cured, the first and second dies are removed, and the hole of the case formed by one of the first die is closed with a cap to complete a receptacle.

摘要翻译： 在制造光纤连接器用模块的方法中，预先模制板状透明电路单元。 电路模块与连接到引线的光电元件一起传输模制。 电路模块被夹持在一对棒状的第一管芯之间，所述棒状第一管芯具有共同的中心轴线，并且其中一个限定了模块的光路，使得光电子元件位于电路模块的中心轴线上 。 在这种情况下，电路模块容纳在由一对第二模具限定的空腔中。 将遮光成型材料注入到注射成型用的模腔内成型。 在壳体固化之后，去除第一和第二模具，并且用盖子封闭由第一模具中的一个模具形成的壳体的孔以完成容器。

公开(公告)号：US4695858A

公开(公告)日：1987-09-22

申请号：US514250

申请日：1983-07-15

申请人： Hatsuo Takezawa ,  Kenichi Donuma ,  Shuhei Katagiri ,  Shigeyuki Sakura

发明人： Hatsuo Takezawa ,  Kenichi Donuma ,  Shuhei Katagiri ,  Shigeyuki Sakura

IPC分类号： H01L31/12

CPC分类号： H01L31/12 ,  H01L2924/3025

摘要： A duplex optical communication module unit is disclosed, which comprises a ceramic substrate and first and second metal shells having respective transparent window members and hermetically bonded to the ceramic substrate so as to define a first and second space, respectively. A light-emitting element is assembled in the first space, and a light-emitting element and a circuit element for amplifying the photocurrent from the light-emitting element are assembled in the second space. Metallization layers are formed on the ceramic substrate over a substantial area thereof, light-receiving and light-transmitting sections being shielded by the metallization layers and metal shells.

摘要翻译： 公开了一种双面光通信模块单元，其包括陶瓷基板和具有各自的透明窗口部件的第一和第二金属壳体，并分别与陶瓷基板气密地接合以便限定第一和第二空间。 发光元件组装在第一空间中，并且发光元件和用于放大来自发光元件的光电流的电路元件组装在第二空间中。 金属化层在其大部分区域上形成在陶瓷基板上，光接收和透光部分被金属化层和金属壳屏蔽。

公开(公告)号：US4647148A

公开(公告)日：1987-03-03

申请号：US594018

申请日：1984-03-27

申请人： Shuhei Katagiri

发明人： Shuhei Katagiri

IPC分类号： G02B6/42 ,  H01L31/02 ,  H01L31/0203 ,  H05K9/00

CPC分类号： H01L31/0203 ,  G02B6/4277 ,  G02B6/4251 ,  G02B6/4265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/73 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/3025

摘要： A fiber optic receiver module comprises a substrate and circuit elements (i.e., IC and resistors, etc.) mounted on the substrate. The IC are electrically connected by bonding wires and bonding pads to input and output conductive patterns extending within the substrate. The leads of a photodetector are electrically connected to the input lines of the IC by pads formed on the substrate and the input conductive pattern. The output terminals of the module are connected to the output terminals of the IC by the output conductive pattern. Conductive layers are formed within the substrate. They are held at ground potential. The input and output conductive patterns are shielded from one another by these conductive layers. The circuit elements are shielded from the outside by a seal ring and a conductive shell both fixed to the upper surface of the substrate. The photodetector is located within a space defined by the seal ring, a metal cover covering the ring, a receptacle and a metal plate secured to the lower surface of the substrate. Hence, this element is shielded from the circuit elements and the output terminals of the module.

摘要翻译： 光纤接收器模块包括衬底和安装在衬底上的电路元件（即IC和电阻器等）。 IC通过接合线和接合焊盘电连接以输入和输出在衬底内延伸的导电图案。 光电检测器的引线通过形成在基板和输入导电图案上的焊盘与IC的输入线电连接。 模块的输出端子通过输出导体图案连接到IC的输出端子。 在衬底内形成导电层。 他们处于地下潜力。 输入和输出导电图案通过这些导电层彼此屏蔽。 电路元件通过密封环和导电壳体与外部屏蔽，两者都固定到基板的上表面。 光电检测器位于由密封环，覆盖环的金属盖，固定到基板的下表面的容器和金属板所限定的空间内。 因此，该元件与电路元件和模块的输出端子屏蔽。