Liquid-sealing type vibration-isolating device
    1.
    发明授权
    Liquid-sealing type vibration-isolating device 失效
    液封式隔振装置

    公开(公告)号:US5443574A

    公开(公告)日:1995-08-22

    申请号:US248618

    申请日:1994-05-24

    CPC分类号: F16F13/262

    摘要: A liquid-sealing type vibration-isolating device has a primary fluid chamber and a subsidiary fluid chamber which communicate with each other through a short idle orifice and a long shock orifice, and a switch-over valve for connecting the primary and subsidiary fluid chambers with each other through the idle orifice in the low speed revolution range of an engine mounted on the device and through the long shock orifice in the medium-high speed revolution range. During the shifting of the switch-over valve, in order to prevent sudden increase in the spring constant of the device, the primary fluid is short-circuited with the subsidiary fluid chamber through a communication port, the inside of a valve member, a communication bore and an auxiliary communication passage.

    摘要翻译: 液体密封式隔振装置具有通过短的怠速孔和长的冲击孔相互连通的主流体室和辅助流体室,以及用于将初级和辅助流体室与 通过安装在装置上的发动机的低速旋转范围内的空转孔,并在中高速旋转范围内通过长冲击孔。 在切换阀的换档期间,为了防止装置的弹簧常数的突然增加,初级流体通过连通口,阀构件的内部,通气孔与辅助流体室短路 孔和辅助通道。

    Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrate
    2.
    发明授权
    Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrate 有权
    电介质基板与介质基板中具有扼流结构的波导基板之间的波导连接

    公开(公告)号:US08358185B2

    公开(公告)日:2013-01-22

    申请号:US12671627

    申请日:2008-07-31

    IPC分类号: H01P1/04 H01P5/02

    CPC分类号: H01P5/107

    摘要: A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.

    摘要翻译: 一种扼流结构,包括:形成在与波导基板相对的介质基板的表面上的通孔周围的内表面导电图案; 形成在与其分开定位的内表面导电图案的周围的外表面导电图案; 导体开口,设置在所述内表面导电图案和所述外表面导电图案之间,并且其中暴露介电构件; 电介质传输路径在由介电基板的层叠方向远离导体开口远离设置的内层导体形成的一端短路; 以及将内层导体连接到内表面导电图案的多个贯通导体。

    WAVEGUIDE CONNECTION STRUCTURE
    3.
    发明申请
    WAVEGUIDE CONNECTION STRUCTURE 有权
    波形连接结构

    公开(公告)号:US20110187482A1

    公开(公告)日:2011-08-04

    申请号:US12671627

    申请日:2008-07-31

    IPC分类号: H01P1/04

    CPC分类号: H01P5/107

    摘要: A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.

    摘要翻译: 一种扼流结构,包括:形成在与波导基板相对的介质基板的表面上的通孔周围的内表面导电图案; 形成在与其分开定位的内表面导电图案的周围的外表面导电图案; 导体开口,设置在所述内表面导电图案和所述外表面导电图案之间,并且其中暴露介电构件; 电介质传输路径在由介电基板的层叠方向远离导体开口远离设置的内层导体形成的一端短路; 以及将内层导体连接到内表面导电图案的多个贯通导体。