公开(公告)号：US20230318384A1

公开(公告)日：2023-10-05

申请号：US18043654

申请日：2021-08-26

Applicant: Siemens Aktiengesellschaft

Inventor： Steffen Lang ,  Marek Maleika ,  Jürgen Huber ,  Lisa Sponsel

IPC: H02K3/40 ,  H02K3/30 ,  H02K15/10 ,  H01B3/00

CPC classification number: H02K3/40 ,  H02K3/30 ,  H02K15/105 ,  H01B3/002

Abstract: Various applications of the teachings of the present disclosure include a powder coating formulation suitable for producing an insulation system of an electrical machine. The formulation may include: a curable resin mixture; and spherical SiO2 filler particles having a maximum particle diameter of 100 μm.