公开(公告)号：US12113324B2

公开(公告)日：2024-10-08

申请号：US17764437

申请日：2020-06-18

申请人： Siemens Aktiengesellschaft

发明人： Christoph Nöth ,  Marius Münzinger

IPC分类号： H01R13/405 ,  B29C45/14 ,  H01R43/18 ,  H01R43/24 ,  B29L31/34

CPC分类号： H01R43/24 ,  B29C45/14221 ,  B29C45/14467 ,  H01R43/18 ,  B29K2995/0005 ,  B29L2031/3481

摘要： In a method for producing a housing of an electronic module, a lead with a bondable lead surface is injection molded with a plastic in a plastic injection mold such as to leave at least a part of each bondable lead surface from being injection molded and to form the lead with a pin recess which passes through the plastic and has a lead recess in the lead and which is sealed on opposing sides by a stamp component and a matrix component of the injection molded tool when the injection molded tool is closed, with the stamp component and the matrix component being injection-molded after the injection molded tool is closed. An electrically conductive pin element is inserted into the pin recess such as to guide the pin element through the lead recess of the pin recess.