公开(公告)号：US20250040114A1

公开(公告)日：2025-01-30

申请号：US18713869

申请日：2022-09-22

Applicant: Siemens Aktiengesellschaft

Inventor： Rudiger Knofe ,  Martin Franke ,  Bernd Müller ,  Rene Blank ,  Peter Frühauf ,  Stefan Nerreter ,  Matthias Heimann ,  Ulrich Wittreich ,  Carsten Borwieck

IPC: H05K13/08

Abstract: Various embodiments of the teachings herein include methods for recording and evaluating parameter values in an electronics production line to produce electronic assemblies, the production line including a dispenser for applying joining material to a component carrier, a placement device for placing electronic components on the component carrier, and a joining device to join the electronic components to the component carrier. An example method includes: receiving a parameter value from each of the devices; and storing the parameter values in a dataset associated with a defined number of component carrier and with the resulting assemblies.