公开(公告)号：US20240379508A1

公开(公告)日：2024-11-14

申请号：US18686543

申请日：2022-07-13

Applicant: Siemens Aktiengesellschaft

Inventor： Christian Radüge ,  Roland Lorz ,  Bernd Müller ,  Jörg Strogies ,  Matthias Heimann ,  Stefan Stegmeier

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/373 ,  H01L23/62 ,  H01L25/065

Abstract: Various embodiments of the teachings herein include power electronics assemblies. An example assembly includes: a substrate with a metallization forming first and second structures separated from each other by interspaces and with thickness of at least 300 μm; a power semiconductor mounted on the first structure; and an electric insulator having a thermal conductivity of at least 50 W/mK arranged at least sectionally in such a way that the structures adjacent to the respective interspace are thermally connected by the insulator.

公开(公告)号：US20240057262A1

公开(公告)日：2024-02-15

申请号：US18257074

申请日：2021-10-15

Applicant: Siemens Aktiengesellschaft

Inventor： Matthias Heimann ,  Carsten Borwieck ,  Ulrich Wittreich ,  Stefan Nerreter ,  Rüdiger Knofe ,  Peter Frühauf ,  Rene Blank ,  Bernd Müller ,  Martin Franke

IPC: H05K3/12 ,  H05K3/00 ,  H05K1/03

CPC classification number: H05K3/1275 ,  H05K3/0005 ,  H05K1/0373 ,  H05K2203/0126

Abstract: Various embodiments include a method for producing electronic assemblies. The method may include: applying a fluid printing medium in a structured manner using a printing device multiple times consecutively in a sequential series of individual printing steps; measuring a rheological property of the printing medium in an automated repeated series of individual measurement steps during or between the individual printing steps; executing a computer-implemented rheological model for the execution of the individual printing steps, using the repeatedly measured rheological property as a variable input parameter; determining a favorable value for a selected printing parameter with the rheological model based on the currently measured rheological property; and automatically setting the determined favorable value for the selected printing parameter.

公开(公告)号：US20210090798A1

公开(公告)日：2021-03-25

申请号：US16967610

申请日：2019-01-30

Applicant: Siemens Aktiengesellschaft

Inventor： Wilhelm Meyrath ,  Franz Pfleger ,  Peter Prankh ,  Jörg Strogies ,  Bernd Müller ,  Klaus Wilke ,  Matthias Heimann

IPC: H01G2/10 ,  H01G4/30 ,  H01G4/38 ,  H01G2/06 ,  H01G2/08 ,  H01G2/22

Abstract: Various embodiments include a capacitor structure comprising: a plurality of capacitors disposed in a support structure, wherein each of the plurality of capacitors includes a first capacitor electrode and a second capacitor electrode. The support structure includes a first electrode and a second electrode. Each of the plurality of capacitors makes electrical contact with the first electrode via the respective first capacitor electrode and with the second electrode via the respective second capacitor electrode. The support structure includes a mounting side for surface mounting, the mounting side comprising a first contact area of the first electrode and a second contact area of the second electrode. The support structure defines a cuboid interior and the capacitors are disposed in the cuboid interior. An outer side of the support structure defines an additional structural framework outside the mounting side.

公开(公告)号：US20200152532A1

公开(公告)日：2020-05-14

申请号：US16609580

申请日：2018-04-20

Applicant: Siemens Aktiengesellschaft

Inventor： Rene Blank ,  Martin Franke ,  Peter Frühauf ,  Rüdiger Knofe ,  Bernd Müller ,  Stefan Nerreter ,  Jörg Strogies ,  Klaus Wilke

IPC: H01L23/15 ,  H01L23/367 ,  H01L23/433 ,  H01L23/00

Abstract: Various embodiments include an electronic assembly comprising: a first substrate; a second substrate; and a component located between the first substrate and the second substrate. The component is in contact with the first substrate and the second substrate. A gap between the first substrate and the component is bridged with an auxiliary joining material. The first substrate defines a through-hole opening into the gap and sealed by the auxiliary joining material. The first substrate and the second substrate define a cavity closed against the environment.

公开(公告)号：US20250040114A1

公开(公告)日：2025-01-30

申请号：US18713869

申请日：2022-09-22

Applicant: Siemens Aktiengesellschaft

Inventor： Rudiger Knofe ,  Martin Franke ,  Bernd Müller ,  Rene Blank ,  Peter Frühauf ,  Stefan Nerreter ,  Matthias Heimann ,  Ulrich Wittreich ,  Carsten Borwieck

IPC: H05K13/08

Abstract: Various embodiments of the teachings herein include methods for recording and evaluating parameter values in an electronics production line to produce electronic assemblies, the production line including a dispenser for applying joining material to a component carrier, a placement device for placing electronic components on the component carrier, and a joining device to join the electronic components to the component carrier. An example method includes: receiving a parameter value from each of the devices; and storing the parameter values in a dataset associated with a defined number of component carrier and with the resulting assemblies.

公开(公告)号：US20240013511A1

公开(公告)日：2024-01-11

申请号：US18042919

申请日：2021-08-12

Applicant: Siemens Aktiengesellschaft

Inventor： Peter Frühauf ,  Rene Blank ,  Matthias Heimann ,  Bernd Müller

IPC: G06V10/75 ,  H05K3/34 ,  H01L23/544 ,  H05K1/02 ,  H05K1/18 ,  G06K7/10 ,  G06V20/80

CPC classification number: G06V10/759 ,  H05K3/3436 ,  H01L23/544 ,  H05K1/0275 ,  H05K1/181 ,  G06K7/1099 ,  G06V20/80 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L24/48

Abstract: Various embodiments of the teachings herein include a computer-implemented method for generating an identification data set for an electronic module having a substrate, a joint, and an electronic component. An example method includes: providing a digital and/or X-ray recording of at least a partial region of the module; and generating the identification data set based on at least a portion of the recording, the portion including the joint. The identification data set identifies at least one of a number, an arrangement, and/or a size of gas inclusions in the joint.

公开(公告)号：US20220336408A1

公开(公告)日：2022-10-20

申请号：US17640937

申请日：2020-09-03

Applicant: Siemens Aktiengesellschaft

Inventor： Nora Jeske ,  Bernd Müller ,  Christian Nachtigall-Schellenberg ,  Jörg Strogies ,  Klaus Wilke

IPC: H01L23/00 ,  H01L21/56

Abstract: Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.

公开(公告)号：US20180269371A1

公开(公告)日：2018-09-20

申请号：US15761485

申请日：2016-09-07

Applicant: Siemens Aktiengesellschaft

Inventor： Martin Franke ,  Peter Frühauf ,  Rüdiger Knofe ,  Bernd Müller ,  Stefan Nerreter ,  Michael Niedermayer ,  Ulrich Wittreich ,  Manfred Zäske

IPC: H01L35/30 ,  H02H5/04 ,  H05K1/02 ,  F04D33/00 ,  F04D25/06

CPC classification number: H01L35/30 ,  F04D25/06 ,  F04D33/00 ,  H01L23/38 ,  H01L23/467 ,  H01L35/28 ,  H02H5/04 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.

公开(公告)号：US20240038621A1

公开(公告)日：2024-02-01

申请号：US18256998

申请日：2021-10-29

Applicant: Siemens Aktiengesellschaft

Inventor： Jörg Strogies ,  Matthias Heimann ,  Bernd Müller ,  Klaus Wilke ,  Markus Pfeifer

IPC: H01L23/373 ,  H01L23/473

CPC classification number: H01L23/3733 ,  H01L23/473

Abstract: Various embodiments of the teachings herein include an apparatus comprising: a component; a cooling element; and a connecting element arranged between the component and the cooling element to thermally couple the cooling element to the component. The connecting element comprises a porous connecting body including a metal material. Pores of the connecting body are at least in part filled with a filling material including a low-melting alloy or a fluorinated organic liquid.

公开(公告)号：US20230215838A1

公开(公告)日：2023-07-06

申请号：US17928318

申请日：2021-05-19

Applicant: Siemens Aktiengesellschaft

Inventor： Bernd Müller ,  Christian Nachtigall-Schellenberg ,  Jörg Strogies ,  Klaus Wilke

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L24/92 ,  H01L24/33 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L21/563 ,  H01L23/3185 ,  H01L2224/33183 ,  H01L2224/3303 ,  H01L2224/29191 ,  H01L2924/0715 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/16227 ,  H01L2224/9211 ,  H01L2224/81201 ,  H01L2224/83201 ,  H01L2224/8184 ,  H01L2224/83102 ,  H01L23/585

Abstract: Various embodiments of the teachings herein include a method for joining and insulating a power electronic semiconductor component with contact surfaces to a substrate. In some embodiments, the method includes: preparing the substrate with a metallization defining an installation slot having joining material, wherein the substrate comprises an organic or a ceramic wiring support; arranging an electrically insulating film and the semiconductor component on the substrate, such that the contact surfaces of the semiconductor component facing the substrate are omitted from the film and regions of the semiconductor component exposed by the contact surfaces are insulated at least in part by the film from the substrate and from the contact surfaces; and joining the semiconductor component to the substrate and electrically insulating the semiconductor component at least in part by the film in one step.