公开(公告)号：US20180061747A1

公开(公告)日：2018-03-01

申请号：US15397927

申请日：2017-01-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Chien-Hui Wang ,  Chung-Yan Huang ,  Ying-Chou Tsai

IPC: H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/60 ,  H01L23/00

CPC classification number: H01L23/49811 ,  G06K9/0002 ,  G06K9/00053 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49805 ,  H01L23/562 ,  H01L23/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.

公开(公告)号：US09978673B2

公开(公告)日：2018-05-22

申请号：US15397927

申请日：2017-01-04

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Chien-Hui Wang ,  Chung-Yan Huang ,  Ying-Chou Tsai

IPC: H01L21/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/60 ,  H01L23/00 ,  G06K9/00

CPC classification number: H01L23/49811 ,  G06K9/0002 ,  G06K9/00053 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49805 ,  H01L23/562 ,  H01L23/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.