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公开(公告)号：US10833394B2
公开(公告)日：2020-11-10
申请号：US16535022
申请日：2019-08-07
发明人： Wen-Jung Tsai , Mao-Hua Yeh , Chih-Hsien Chiu , Ying-Chou Tsai , Chun-Chi Ke
IPC分类号： H01L23/00 , H01Q1/22 , H01L23/31 , H01L23/498 , H01L23/66 , H01L25/065 , H01L25/00 , H01L21/48 , H01L21/56 , H01Q1/36 , H01Q1/38 , H01Q1/40 , H01Q9/04 , H01L23/538 , H01L21/77
摘要： An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.
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公开(公告)号：US20190043819A1
公开(公告)日：2019-02-07
申请号：US15869249
申请日：2018-01-12
发明人： Chi-Ching Ho , Ying-Chou Tsai
摘要： An electronic package is provided, including an electronic component, a redistribution structure formed on the electronic component, a plurality of conductive posts bonded to the redistribution structure, and a redistribution layer bonded to the conductive posts. As such, the electronic component that meets the requirement of miniaturization can be electrically connected to an electronic device through the redistribution structure, the conductive posts and the redistribution layer.
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公开(公告)号：US20180061747A1
公开(公告)日：2018-03-01
申请号：US15397927
申请日：2017-01-04
发明人： Shao-Tzu Tang , Jia-Fong Yeh , Chien-Hui Wang , Chung-Yan Huang , Ying-Chou Tsai
IPC分类号： H01L23/498 , H01L21/56 , H01L21/48 , H01L23/60 , H01L23/00
CPC分类号： H01L23/49811 , G06K9/0002 , G06K9/00053 , H01L21/4853 , H01L21/56 , H01L23/49805 , H01L23/562 , H01L23/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014
摘要： A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.
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公开(公告)号：US20170047230A1
公开(公告)日：2017-02-16
申请号：US15293858
申请日：2016-10-14
发明人： Chi-Ching Ho , Ying-Chou Tsai , Sheng-Che Huang
IPC分类号： H01L21/48 , H01L23/00 , H05K3/46 , H05K3/06 , H05K3/34 , H01L21/683 , H01L23/498 , H05K3/40
CPC分类号： H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L24/16 , H01L24/81 , H01L2221/68345 , H01L2224/16225 , H01L2224/16238 , H01L2224/81193 , H05K3/064 , H05K3/205 , H05K3/3436 , H05K3/4007 , H05K3/4038 , H05K3/4682 , H05K2201/0376 , Y02P70/613 , Y10T29/49158
摘要： A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.
摘要翻译： 公开了一种封装基板，包括：介电层; 电介质层，其中所述电路层嵌入并暴露于所述电介质层的表面，其中所述电路层具有多个导电焊盘; 以及形成在所述导电焊盘上并突出在所述电介质层的表面上方的多个导电凸块。 这样，当通过多个导电元件将电子元件设置在导电焊盘上时，导电元件可以与导电凸块的顶表面和侧表面接触，从而增加导电元件与导电元件之间的接触面积 导电焊盘，从而加强导电元件和导电焊盘之间的接合，并防止导电元件与导电焊盘分层。
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公开(公告)号：US09362217B2
公开(公告)日：2016-06-07
申请号：US14290145
申请日：2014-05-29
发明人： Pang-Chun Lin , Wei-Ping Wang , Chun-Yuan Li , Shao-tzu Tang , Ying-Chou Tsai
IPC分类号： H01L21/00 , H01L23/498 , H01L23/538 , H01L25/10
CPC分类号： H01L23/49811 , H01L23/49827 , H01L23/5389 , H01L25/105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： A method for fabricating a POP structure is disclosed. First, a first package is provided, which has: a dielectric layer; a stacked circuit layer embedded in the dielectric layer and exposed from upper and lower surfaces of the dielectric layer; a plurality of conductive posts and a semiconductor chip disposed on the upper surface of the dielectric layer and electrically connected to the stacked circuit layer; and an encapsulant formed on upper surface of the dielectric layer for encapsulating the semiconductor chip and the conductive posts and having a plurality of openings for exposing top ends of the conductive posts. Then, a second package is disposed on the encapsulant and electrically connected to the conductive posts. The formation of the conductive posts facilitates to reduce the depth of the openings of the encapsulant, thereby reducing the fabrication time and increasing the production efficiency and yield.
摘要翻译： 公开了一种用于制造POP结构的方法。 首先，提供第一封装，其具有：介电层; 嵌入介电层中并从电介质层的上表面和下表面露出的堆叠电路层; 多个导电柱和设置在电介质层的上表面上并电连接到堆叠电路层的半导体芯片; 以及密封剂，其形成在所述电介质层的上表面上，用于封装所述半导体芯片和所述导电柱，并具有用于暴露所述导电柱的顶端的多个开口。 然后，第二包装被设置在密封剂上并电连接到导电柱。 导电柱的形成有助于减小密封剂的开口的深度，从而减少制造时间并提高生产效率和产率。
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公开(公告)号：US20210066173A1
公开(公告)日：2021-03-04
申请号：US17096359
申请日：2020-11-12
发明人： Shao-Tzu Tang , Jia-Fong Yeh , Yi-Hsuan Liu , Mei-Chi Chen , Ying-Chou Tsai
IPC分类号： H01L23/495 , H01L23/498 , H01L21/56 , H01L23/00 , H01L23/31
摘要： A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.
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公开(公告)号：US10224243B2
公开(公告)日：2019-03-05
申请号：US15704388
申请日：2017-09-14
发明人： Shao-Tzu Tang , Chang-Yi Lan , Ying-Chou Tsai
摘要： An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element; and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.
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公开(公告)号：US09699910B2
公开(公告)日：2017-07-04
申请号：US14453952
申请日：2014-08-07
发明人： Shao-tzu Tang , Ying-Chou Tsai
CPC分类号： H05K3/0014 , H05K1/116 , H05K2201/09118 , H05K2201/09545 , H05K2201/09563 , Y10T29/49167
摘要： A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.
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公开(公告)号：US20150305162A1
公开(公告)日：2015-10-22
申请号：US14461828
申请日：2014-08-18
发明人： Shao-tzu Tang , Chi-Ching Ho , Ying-Chou Tsai
CPC分类号： H05K1/186 , H01L23/49822 , H01L23/50 , H01L28/40 , H01L2924/0002 , H05K1/115 , H05K3/10 , H05K3/42 , H05K2201/10015 , H05K2203/0733 , H01L2924/00
摘要： A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density.
摘要翻译： 提供一种封装基板的制造方法，其包括以下步骤：在载体上形成第一导电部分; 在每个第一导电部分上依次形成导电柱和取向层; 在载体上形成密封剂，用于封装第一导电部分，导电柱和对准层; 在所述密封剂中的每个取向层上形成导电孔，并在所述导电通孔和所述密封剂上形成第二导电部分; 并移除载体。 每个第一导电部分和相应的导电柱，对准层和导电通孔形成导电结构。 取向层具有大于导电柱和导电通孔的垂直投影面积，从而减小导电柱和导电通孔的尺寸，从而增加布线密度和电子元件安装密度。
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公开(公告)号：US11114393B2
公开(公告)日：2021-09-07
申请号：US16534385
申请日：2019-08-07
发明人： Wen-Jung Tsai , Ching-Chia Chen , Ying-Chou Tsai
摘要： An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.
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