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公开(公告)号：US11114393B2
公开(公告)日：2021-09-07
申请号：US16534385
申请日：2019-08-07
发明人： Wen-Jung Tsai , Ching-Chia Chen , Ying-Chou Tsai
摘要： An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.
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公开(公告)号：US20200328166A1
公开(公告)日：2020-10-15
申请号：US16534385
申请日：2019-08-07
发明人： Wen-Jung Tsai , Ching-Chia Chen , Ying-Chou Tsai
摘要： An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.
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