公开(公告)号：US20200043908A1

公开(公告)日：2020-02-06

申请号：US16164416

申请日：2018-10-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chee-Key Chung ,  Chang-Fu Lin ,  Han-Hung Chen ,  Jen-Chieh Hsiao ,  Rung-Jeng Lin ,  Kuo-Hua Yu ,  Hong-Da Chang

IPC: H01L25/00 ,  H01L23/538 ,  H01L21/48 ,  H01L25/10 ,  H01L21/683 ,  H01L21/56 ,  H01L23/00

Abstract: A package stacked structure and a method for fabricating the same are provided. The method includes providing a wiring structure disposed with a carrier and a carrier structure provided with an electronic component. The wiring structure is bonded to the carrier structure via a plurality of conductive elements. An encapsulating layer is formed between the wiring structure and the carrier structure and encapsulates the conductive elements and the electronic component. The carrier is then removed. With the arrangement of the carrier, the structural strength of the wiring structure is improved, and warpage of the wiring structure is prevented before stacking the wiring structure onto the carrier structure.