公开(公告)号：US20210066173A1

公开(公告)日：2021-03-04

申请号：US17096359

申请日：2020-11-12

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Yi-Hsuan Liu ,  Mei-Chi Chen ,  Ying-Chou Tsai

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.

公开(公告)号：US20180342446A1

公开(公告)日：2018-11-29

申请号：US15720552

申请日：2017-09-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Jia-Fong Yeh ,  Yi-Hsuan Liu ,  Mei-Chi Chen ,  Ying-Chou Tsai

IPC: H01L23/495 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

Abstract: A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.