SYSTEMS AND METHODS FOR COOLING ELECTRONICS

    公开(公告)号:US20230112805A1

    公开(公告)日:2023-04-13

    申请号:US17497874

    申请日:2021-10-08

    摘要: In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.

    JOULE-THOMPSON COOLER ACTUATION SYSTEMS

    公开(公告)号:US20230114102A1

    公开(公告)日:2023-04-13

    申请号:US17450449

    申请日:2021-10-08

    摘要: In accordance with at least one aspect of this disclosure, an actuation system for a guided munition, includes a reservoir disposed in a guided munition body housing a compressible fluid in a compressed state, a fluid path connecting the reservoir in fluid communication with a heat exchange volume, a throttling orifice disposed in the fluid path configured to expand the compressible fluid, and an actuation path connecting the heat exchange volume in fluid communication with a moveable component. The actuation path can be configured to supply pneumatic pressure to the moveable components.