公开(公告)号：US20240355943A1

公开(公告)日：2024-10-24

申请号：US18761587

申请日：2024-07-02

申请人： Gatan, Inc.

发明人： Paul MOONEY ,  Matthew LENT ,  Julio KOVACS ,  David JOYCE

IPC分类号： H01L31/024 ,  H01L27/146

CPC分类号： H01L31/024 ,  H01L27/1464 ,  H01L27/14685

摘要： A solid state active pixel image sensor for back illumination by an electron beam is described. The image sensor comprises a thermal conduction layer for heat removal. The image sensor may also comprise a thinned silicon substrate on which an epitaxial layer is formed. The substrate may also be completely removed before or after application of the thermal conduction layer. The thermal conduction layer may comprise a metal, a metal compound, silicon, diamond or graphite.

公开(公告)号：US12068422B2

公开(公告)日：2024-08-20

申请号：US17497874

申请日：2021-10-08

申请人： Simmonds Precision Products, Inc.

发明人： Craig R. Bibeau ,  Jason Graham

IPC分类号： H01L31/024 ,  H01L23/427 ,  H01L23/473

CPC分类号： H01L31/024 ,  H01L23/427 ,  H01L23/473

摘要： In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.

公开(公告)号：US12034093B2

公开(公告)日：2024-07-09

申请号：US17310146

申请日：2019-11-25

申请人： SONY SEMICONDUCTOR SOLUTIONS CORPORATION

发明人： Toshiki Koyama

IPC分类号： H01L31/024 ,  H01L27/146

CPC分类号： H01L31/024 ,  H01L27/14634

摘要： Heat is efficiently discharged without impairing an imaging characteristic of a solid-state imaging element mounted on a substrate. A semiconductor device is provided with a substrate, the solid-state imaging element, and an adhesive portion that adheres the substrate and the solid-state imaging element. The substrate is a substrate provided with metal wiring. The solid-state imaging element is mounted on a surface of the substrate. The adhesive portion adheres a predetermined region on one surface of the solid-state imaging element to the substrate. The adhesive portion has predetermined thermal conductivity and discharges heat generated in the solid-state imaging element toward the substrate.

公开(公告)号：US12002894B2

公开(公告)日：2024-06-04

申请号：US17567194

申请日：2022-01-03

申请人： Sumitomo Electric Industries, Ltd.

发明人： Kotaro Hirose ,  Masahiro Adachi ,  Yoshiyuki Yamamoto ,  Shunsuke Fujii ,  Fuminori Mitsuhashi

IPC分类号： H01L31/0216 ,  H01L31/0224 ,  H01L31/024

CPC分类号： H01L31/0216 ,  H01L31/0224 ,  H01L31/024

摘要： A photosensor includes: a support; a thermoelectric conversion material section that is disposed on a first main surface of the support and that includes a plurality of first material layers each having an elongated shape, a plurality of second material layers each having electrical conductivity and an elongated shape, and an insulating film, the first material layers and the second material layers each being configured to convert thermal energy into electrical energy; a heat sink that is disposed on a second main surface of the support and along an outer edge of the support; a light-absorbing film that is disposed in a region surrounded by inner edges of the heat sink as viewed in a thickness direction of the support so as to form temperature differences on the first main surface of the support in longitudinal directions of the first material layers.

公开(公告)号：US11942504B2

公开(公告)日：2024-03-26

申请号：US17819821

申请日：2022-08-15

申请人： OMNIVISION TECHNOLOGIES, INC.

发明人： Sing-Chung Hu

IPC分类号： H01L27/146 ,  H01L23/467 ,  H01L31/024

CPC分类号： H01L27/14636 ,  H01L23/467 ,  H01L27/14634 ,  H01L27/1469 ,  H01L31/024

摘要： Image sensors include a pixel die that is stacked on a logic die. The logic die includes at least one function logic element disposed on a bond side thereof, and a logic oxide array of raised logic oxide features also disposed on the bond side. The pixel die includes a pixel array disposed on a light receiving side thereof, and a pixel oxide array of raised pixel oxide features disposed on a bond side of the pixel die. A plurality of outer bonds is disposed between an outer region of the logic die and an outer region of the pixel die. A plurality of inner bonds is formed at an inner region of the image sensor between the pixel oxide array and the logic oxide array, the inner bonds being spaced apart by a plurality of fluidly connected air gaps that extend between the logic die and the pixel die.

公开(公告)号：US11888081B2

公开(公告)日：2024-01-30

申请号：US17227152

申请日：2021-04-09

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Mei-Yi Wu ,  Chang Chin Tsai ,  Bo-Yu Huang ,  Ying-Chung Chen

IPC分类号： H01L31/16 ,  H04B10/40 ,  H01L33/64 ,  H01L33/62 ,  H01L31/024

CPC分类号： H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/644 ,  H04B10/40

摘要： The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20240021740A1

公开(公告)日：2024-01-18

申请号：US18220877

申请日：2023-07-12

申请人： Zhuhai ACCESS Semiconductor Co., Ltd

发明人： Xianming CHEN ,  Lei FENG ,  Benxia HUANG ,  Jiangjiang ZHAO ,  Zhijun ZHANG

IPC分类号： H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L31/12 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L31/02325 ,  H01L31/024 ,  H01L31/125 ,  H01L31/18

摘要： A method for manufacturing a light-emitting photosensitive sensor structure includes preparing a package substrate, wherein the package substrate has a cavity formed by a light-shield frame performing enclosing, and the bottom of the cavity is provided with a first line layer, forming a light transmission channel on the light-shield frame, mounting a light-emitting photosensitive sensor in the cavity of the package substrate so that the photosensitive luminescent device is electrically connected to the first line layer, filling the cavity and the light transmission channel with a transparent encapsulating material to form a transparent packaging layer on the photosensitive luminescent device, forming a light-shield layer on the transparent packaging layer, and performing cutting along a cutting line of the light-shield frame to obtain a light-emitting photosensitive sensor structure having a directional light transmission channel.

公开(公告)号：US11695093B2

公开(公告)日：2023-07-04

申请号：US16679549

申请日：2019-11-11

申请人： Analog Devices, Inc.

发明人： Shrenik Deliwala ,  Ryan Michael Iutzi

IPC分类号： H01L33/06 ,  H01L33/58 ,  H01L33/64 ,  H01L31/0352 ,  H01L31/0232 ,  H01L31/024

CPC分类号： H01L33/06 ,  H01L31/024 ,  H01L31/02327 ,  H01L31/035236 ,  H01L33/58 ,  H01L33/644

摘要： A device emitting mid-infrared light that comprises a semiconductor substrate of GaSb or closely related material. The device can also comprise epitaxial heterostructures of InAs, GaAs, AlSb, and related alloys forming light emitting structures cascaded by tunnel junctions. Further, the device can comprise light emission from the front, epitaxial side of the substrate.

公开(公告)号：US11658252B2

公开(公告)日：2023-05-23

申请号：US17574994

申请日：2022-01-13

申请人： Materion Corporation

发明人： Michael P. Newell ,  Zan Aslett ,  Robert Cuzziere ,  Andrew P. Houde ,  Derrick Brown

IPC分类号： H01L31/0232 ,  H01L31/024 ,  H01L31/18 ,  C03C14/00 ,  C04B37/02 ,  G03B21/20 ,  G03B21/16 ,  H01L33/64 ,  H01L33/50

CPC分类号： H01L31/02327 ,  C03C14/006 ,  C04B37/026 ,  G03B21/16 ,  G03B21/204 ,  H01L31/024 ,  H01L31/18 ,  C04B2237/122 ,  C04B2237/123 ,  C04B2237/125 ,  C04B2237/127 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/72 ,  C04B2237/84 ,  H01L33/501 ,  H01L33/505 ,  H01L33/507 ,  H01L33/644

摘要： A light generator comprises a light conversion device and a light source arranged to apply a light beam to the light conversion element. The light conversion device includes an optoceramic or other solid phosphor element comprising one or more phosphors embedded in a ceramic, glass, or other host, a metal heat sink, and a solder bond attaching the optoceramic phosphor element to the metal heat sink. The optoceramic phosphor element does not undergo cracking in response to the light source applying a light beam of beam energy effective to heat the optoceramic phosphor element to the phosphor quenching point.

公开(公告)号：US20190067350A1

公开(公告)日：2019-02-28

申请号：US15773617

申请日：2016-10-07

申请人： SONY CORPORATION

发明人： KEIKI FUKUDA

IPC分类号： H01L27/146 ,  H01L31/024

CPC分类号： H01L27/14618 ,  H01L27/14 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14683 ,  H01L31/024 ,  H04N5/2252 ,  H04N5/2253

摘要： An image pickup element package according to an embodiment of the present technology includes a solid-state image pickup element, a circuit board, a translucent substrate, and a support. The solid-state image pickup element includes a light-receiving surface, and a back surface on a side opposite to the light-receiving surface. The circuit board supports the back surface of the solid-state image pickup element. The translucent substrate is opposed to the light-receiving surface. The support includes a resin frame portion and a conductor portion and is disposed between the circuit board and the translucent substrate. The resin frame portion includes a hollow portion that houses the solid-state image pickup element, and a fixation portion that is fixed to a casing portion of an image-pickup device. The conductor portion is integrally provided in the resin frame portion and provides thermal connection between the circuit board and the fixation portion.