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公开(公告)号:US11806786B2
公开(公告)日:2023-11-07
申请号:US17832690
申请日:2022-06-06
申请人: Sodick Co., Ltd.
发明人: Ichiro Araie , Toshio Kaji , Tatsuro Hayakawa , Hiroshi Amioka , Atsushi Hirota
CPC分类号: B22F12/67 , B22F10/28 , B22F12/30 , B22F12/41 , B22F12/49 , B22F2998/10 , B33Y10/00 , B33Y30/00
摘要: A stress controlled layer is constituted to include a compressive stress applied part that is a region to which a compressive stress is applied and a compressive stress non-applied part that is a region different from the compressive stress applied part. In a solidifying step, scanning of a laser beam or an electron beam is performed while a scanning direction for the compressive stress applied part is different from a scanning direction for the compressive stress non-applied part such that the compressive stress applied part expands further than the compressive stress non-applied part or the compressive stress non-applied part shrinks compared with the compressive stress applied part based on a relationship between the scanning direction and an expansion quantity or a shrinkage quantity at a time of temperature change or at a time of heat treatment.
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公开(公告)号:US11370029B2
公开(公告)日:2022-06-28
申请号:US16503640
申请日:2019-07-05
申请人: SODICK CO., LTD.
发明人: Toshio Kaji
摘要: The disclosure provides a method of additive manufacturing a three-dimensional object, which can prevent a blade from being caught by a deformed part that is generated due to an unpredictable change of a sintering condition. In the method of additive manufacturing the three-dimensional object, if a deformed part having any height is generated on the upper surface of the nth sintered layer, when the next n+1th sintered layer is formed, the n+1th powder layer is irradiated with laser by avoiding the region where the deformed part is generated. Then, after the n+2th powder layer is formed, the unsintered part is sintered together with the n+2th powder layer.
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公开(公告)号:US11794252B2
公开(公告)日:2023-10-24
申请号:US17335041
申请日:2021-05-31
申请人: Sodick Co., Ltd.
IPC分类号: B22F10/28 , B33Y10/00 , B33Y30/00 , B22F12/41 , B22F10/85 , B22F12/49 , B22F10/366 , B33Y50/00
CPC分类号: B22F10/28 , B22F10/366 , B22F10/85 , B22F12/41 , B22F12/49 , B33Y10/00 , B33Y30/00 , B33Y50/00
摘要: A lamination molding method, which repeats a material layer forming step of forming a material layer and a solidifying step of irradiating an irradiation region of the material layer with laser beams scanned by n scanners to form a solidified layer, includes: a first dividing step and an irradiation order deciding step. In the first dividing step, the irradiation region is divided to 2n-1 or more divided regions by a plurality of first dividing lines in a manner that irradiation time of each of the divided regions to which the laser beams are simultaneously irradiated becomes equal. In the irradiation order deciding step, an irradiation order of the divided regions in the solidifying step is decided in a manner that the laser beams are simultaneously irradiated to the divided regions that are not adjacent, and the laser beams are not simultaneously irradiated to the divided regions that are adjacent.
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公开(公告)号:US11872759B2
公开(公告)日:2024-01-16
申请号:US17035758
申请日:2020-09-29
申请人: SODICK CO., LTD.
IPC分类号: B22F12/49 , B29C64/277 , B23K26/082 , B22F10/00 , B22F12/00 , B22F10/28 , B22F12/44 , B33Y30/00 , B22F12/41 , B22F12/45 , B22F12/67 , B22F10/32
CPC分类号: B29C64/277 , B22F10/00 , B22F10/28 , B22F12/38 , B22F12/44 , B22F12/49 , B23K26/0821 , B22F10/32 , B22F12/41 , B22F12/45 , B22F12/67 , B33Y30/00
摘要: An irradiation device of a lamination molding apparatus includes: at least one laser source, generating a laser beam; a first galvano scanner, scanning the laser beam; a second galvano scanner, scanning the laser beam; and an irradiation controller, controlling the laser source, the first galvano scanner, and the second galvano scanner. Irradiable ranges of the laser beams by using the first galvano scanner and the second galvano scanner respectively include an entire of a molding region. A first X-axis galvano mirror and a first Y-axis galvano mirror of the first galvano scanner and a second X-axis galvano mirror and a second Y-axis galvano mirror of the second galvano scanner are disposed to be plane-symmetric to each other.
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