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公开(公告)号：US20210041305A1
公开(公告)日：2021-02-11
申请号：US16964928
申请日：2019-01-23
发明人： Naoki Kawazu , Keita Sasaki , Takumi Oka , Mohammad Munir Haque , Nobuhiko Fujimori , Makoto Satou , Masahiro Baba , Satoshi Yamamoto , Yuichi Motohashi , Atsushi Suzuki
摘要： To obtain an imaging device that can improve temperature detection accuracy. An imaging device of the present disclosure includes a processing unit formed on a first semiconductor substrate and capable of performing predetermined image processing on the basis of image data obtained by an imaging unit, a temperature sensor formed on the first semiconductor substrate and capable of generating a detection signal according to a temperature, and a first pad electrode formed on the first semiconductor substrate and electrically insulated from a circuit formed on the first semiconductor substrate.
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公开(公告)号：US11686630B2
公开(公告)日：2023-06-27
申请号：US16964928
申请日：2019-01-23
发明人： Naoki Kawazu , Keita Sasaki , Takumi Oka , Mohammad Munirul Haque , Nobuhiko Fujimori , Makoto Satou , Masahiro Baba , Satoshi Yamamoto , Yuichi Motohashi , Atsushi Suzuki
CPC分类号： G01K15/005 , G06K7/01 , H04N25/75 , H04N25/79
摘要： To obtain an imaging device that can improve temperature detection accuracy. An imaging device of the present disclosure includes a processing unit formed on a first semiconductor substrate and capable of performing predetermined image processing on the basis of image data obtained by an imaging unit, a temperature sensor formed on the first semiconductor substrate and capable of generating a detection signal according to a temperature, and a first pad electrode formed on the first semiconductor substrate and electrically insulated from a circuit formed on the first semiconductor substrate.
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