Cutting Segment for Cutting Tool and Cutting Tools
    1.
    发明申请
    Cutting Segment for Cutting Tool and Cutting Tools 有权
    切割工具和切割工具切割段

    公开(公告)号:US20080202488A1

    公开(公告)日:2008-08-28

    申请号:US11910611

    申请日:2006-04-19

    IPC分类号: B28D1/04

    摘要: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.

    摘要翻译: 本发明提供了一种用于切割或钻削诸如石头,砖,混凝土和沥青的脆性工件的切割工具的切割部分和具有切割部分的切割工具。 切割段包括用于切割工件和多个磨料颗粒层的切割表面。 研磨颗粒层垂直于切割方向设置。 每个研磨层在切割段的宽度方向上具有多个研磨颗粒行。 每个磨料列具有排列成一行的多个磨料颗粒。 此外,磨料层之间具有多个坯料部分。 在坯料部分中,磨料颗粒不存在或者相对于磨料行的浓度为70%以下。 另外,空白部分包括相对较厚的空白部分和相对较薄的空白部分。

    Cutting segment for cutting tool and cutting tools
    2.
    发明授权
    Cutting segment for cutting tool and cutting tools 有权
    切割工具和切割工具的切割部分

    公开(公告)号:US07954483B2

    公开(公告)日:2011-06-07

    申请号:US11910611

    申请日:2006-04-19

    IPC分类号: B28D1/12

    摘要: The invention provides a cutting segment for a cutting tool for cutting or drilling a brittle work piece such as stone, bricks, concrete and asphalt, and a cutting tool having the cutting segment. The cutting segment includes a cutting surface for cutting a work piece and a plurality of abrasive particle layers. The abrasive particle layers are disposed perpendicular to a cutting direction. Each of the abrasive layers has a plurality of abrasive particle rows in a width direction of the cutting segment. Each of the abrasive rows has a plurality of abrasive particles arranged in a line. Further, the abrasive layers have a plurality of blank sections therebetween. In the blanks sections, abrasive particles are absent or have a concentration of 70% or less with respect to those in the abrasive rows. In addition, the blank sections include relatively thick blank sections and relatively thin blank sections.

    摘要翻译: 本发明提供了一种用于切割或钻削诸如石头,砖,混凝土和沥青的脆性工件的切割工具的切割部分和具有切割部分的切割工具。 切割段包括用于切割工件和多个磨料颗粒层的切割表面。 研磨颗粒层垂直于切割方向设置。 每个研磨层在切割段的宽度方向上具有多个研磨颗粒行。 每个磨料列具有排列成一行的多个磨料颗粒。 此外,磨料层之间具有多个坯料部分。 在坯料部分中,磨料颗粒不存在或者相对于磨料行的浓度为70%以下。 另外,空白部分包括相对较厚的空白部分和相对较薄的空白部分。

    Cutting segment for diamond tool and diamond tool having the segment
    3.
    发明授权
    Cutting segment for diamond tool and diamond tool having the segment 有权
    金刚石刀具和金刚石刀具的切割部分

    公开(公告)号:US07661419B2

    公开(公告)日:2010-02-16

    申请号:US11911798

    申请日:2006-04-20

    IPC分类号: B28D1/12

    摘要: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.

    摘要翻译: 本发明涉及用于切割或钻孔诸如石头,砖,混凝土和沥青的脆性工件的金刚石工具的切割部分和具有该切割部分的金刚石工具。 本发明允许优异的切割速率和长的使用寿命,而不会在切割过程中磨损R。 在切割段中,将多个金刚石颗粒布置在垂直于切割方向堆叠的多个板状层中。 每个金刚石颗粒层在切割表面上具有多个颗粒行。 此外,至少两个金刚石颗粒层在切割方向上从切割区段的前方看到的切割区段的至少一侧重叠。 本发明通过显着减少切割时产生的R磨损,确保均匀切割,从而实现优异的切割速度和更长的使用寿命。

    Cutting Segment For Diamond Tool and Diamond Tool Having the Segment
    4.
    发明申请
    Cutting Segment For Diamond Tool and Diamond Tool Having the Segment 有权
    金刚石工具切割段和分段钻石工具

    公开(公告)号:US20080171505A1

    公开(公告)日:2008-07-17

    申请号:US11911798

    申请日:2006-04-20

    IPC分类号: B24B7/00

    摘要: The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.

    摘要翻译: 本发明涉及用于切割或钻孔诸如石头,砖,混凝土和沥青的脆性工件的金刚石工具的切割部分和具有该切割部分的金刚石工具。 本发明允许优越的切割速率和长的使用寿命,而不会在切割期间磨损。 在切割段中,将多个金刚石颗粒布置在垂直于切割方向堆叠的多个板状层中。 每个金刚石颗粒层在切割表面上具有多个颗粒行。 此外,至少两个金刚石颗粒层在切割方向上从切割区段的前方看到的切割区段的至少一侧重叠。 本发明通过显着减少切割时产生的R磨损,确保均匀切割,从而实现优异的切割速度和更长的使用寿命。