公开(公告)号：US20230278259A1

公开(公告)日：2023-09-07

申请号：US18018076

申请日：2021-08-03

申请人： HUSQVARNA AB

发明人： Philippe Uytters ,  Brianna Welch ,  Fredrik Sjödahl ,  Salvatore Callari

IPC分类号： B28D1/12 ,  B23D61/18

CPC分类号： B28D1/121 ,  B23D61/18

摘要： A cutting segment (110) for mounting onto a saw blade to provide an abrasive operation by the saw blade, the cutting segment comprising a body (200) having a cutting surface (210) facing in a cutting direction (C), and side surfaces (220) facing laterally (L) with respect to the cutting direction (C), wherein a plurality of protrusions (230) extend laterally from the sides (220), and wherein the cutting segment (110, 410, 510) constituted by the body (200) and the protrusions (230) is formed by a homogenous mixture of metal powder and diamond granules.

公开(公告)号：US20180154471A1

公开(公告)日：2018-06-07

申请号：US15736719

申请日：2016-06-15

申请人： SHINHAN DIAMOND IND. CO., LTD.

发明人： Shin kyung KIM

IPC分类号： B23D61/18 ,  B23D61/02

CPC分类号： B23D61/18 ,  B23D61/021 ,  B23D61/026 ,  B23D61/028 ,  B28D1/04 ,  B28D1/121

摘要： A saw blade is provided having a noise and stress-reduction structure, the saw blade having a structure in which a plurality of diamond segments are mounted at a first unit and the first unit has a second unit, thereby reducing the noise generated during a cutting operation, while increasing heating performance with a relatively simple configuration, and simultaneously dispersing impact stress so as to prevent the occurrence of cracks.

公开(公告)号：US20180133926A1

公开(公告)日：2018-05-17

申请号：US15868984

申请日：2018-01-11

申请人： BLOUNT, INC.

发明人： Todd Gerlach

IPC分类号： B28D1/08 ,  B23D61/18 ,  B27B33/14

CPC分类号： B28D1/082 ,  B23D61/18 ,  B27B33/14 ,  B28D1/08 ,  B28D1/124

摘要： Embodiments herein provide a high stability saw chain comprising a first drive link including a first mating surface; a second drive link including a second mating surface; a first tie strap coupling the first drive link to the second drive link; wherein the first mating surface of the first drive link is configured to contact the second mating surface of the second drive link when the first and second drive links traverse an elongate portion of a guide bar to prevent reverse articulation of the saw chain less than a minimum radius of 20 inches.

公开(公告)号：US09876078B2

公开(公告)日：2018-01-23

申请号：US14212370

申请日：2014-03-14

申请人： SUMCO TECHXIV CORPORATION

发明人： Hiroshi Noguchi

IPC分类号： B28D1/08 ,  B23D61/18 ,  H01L29/06 ,  B28D5/04 ,  B23D57/00 ,  B28D5/00

CPC分类号： H01L29/0657 ,  B23D57/0023 ,  B23D57/0046 ,  B23D61/18 ,  B28D1/08 ,  B28D5/0088 ,  B28D5/042 ,  B28D5/045 ,  Y10T428/21

摘要： An amount of warp of a wafer is not only reduced, but the amount of warp of the wafer is also accurately controlled to a desired amount. The present invention relates to a method for slicing a semiconductor single crystal ingot, by which a cylindrical semiconductor single crystal ingot is bonded to and held by a holder in a state where the ingot is rotated at a predetermined rotation angle around a crystal axis of the ingot different from a center axis of a cylinder of this ingot and the ingot is sliced by a cutting apparatus in this state. The predetermined rotation angle at the time of bonding and holding the ingot with the use of the holder in such a manner that an amount of warp of a wafer sliced out by the cutting apparatus becomes a predetermined amount.

公开(公告)号：US20170189978A1

公开(公告)日：2017-07-06

申请号：US15313138

申请日：2015-05-08

申请人： NV BEKAERT SA

发明人： Tom BAEKELANDT ,  Steven DERYCKE

IPC分类号： B23D61/18 ,  B23D61/00 ,  B28D1/08 ,  B23D65/00 ,  B28D1/12

CPC分类号： B23D61/185 ,  B23D61/00 ,  B23D61/18 ,  B23D65/00 ,  B28D1/08 ,  B28D1/124

摘要： Saw cords made of saw beads threaded on a steel cord, where the saw beads are separated by polymer spacers. The saw beads have a metal sleeve of which the outer surface is covered with an abrasive layer. The inner surface of the sleeve has with two sets of parallel grooves in a first and second axial part of the sleeve. The two sets of parallel grooves differ in at least one of the groove angle, the groove offset or the groove spacing, thereby preventing axial movement of the sleeve and blocking the rotation of the saw bead.

公开(公告)号：US20170157798A1

公开(公告)日：2017-06-08

申请号：US15373297

申请日：2016-12-08

申请人： BLOUNT, INC.

发明人： Todd Gerlach

IPC分类号： B28D1/08 ,  B23D61/18 ,  B27B33/14

CPC分类号： B28D1/082 ,  B23D61/18 ,  B27B33/14

摘要： Embodiments herein provide an abrasive saw chain that includes drive links and tie straps coupled to one another. Cutting elements, such as diamond cutting elements, may be coupled to upper surfaces of respective drive links. An upper surface of the tie strap may contact a lower surface of a cutting element to provide support for the cutting element. The tie strap may include a limiting feature to contact front and/or back surfaces of adjacent cutting elements when the links traverse an elongate portion of a guide bar. Alternatively, or additionally, the drive links may include a mating surface that contacts a mating surface of an adjacent drive link when the drive links traverse the elongate portion of the guide bar. Other embodiments may be described and/or claimed.

公开(公告)号：US09610641B2

公开(公告)日：2017-04-04

申请号：US11722157

申请日：2005-12-12

申请人： Jean-Pierre Vaubourg

发明人： Jean-Pierre Vaubourg

IPC分类号： B23D61/18 ,  B28D1/08 ,  B23D57/00 ,  B28D5/04

CPC分类号： B23D61/185 ,  B23D57/0007 ,  B23D57/003 ,  B23D61/18 ,  B28D1/08 ,  B28D5/045

摘要： Monofilament metal saw wire for a wire saw, wherein the saw wire being provided with a plurality of crimps. The crimps are arranged in at least two different planes, such that, when measured, between measuring rods of a micrometer, over a length comprising crimps in at least two different planes, a circumscribed enveloping D diameter of the saw wire is between 1.05 and 1.50 times a diameter d of the saw wire itself.

公开(公告)号：US20170066069A1

公开(公告)日：2017-03-09

申请号：US15355454

申请日：2016-11-18

申请人： SAINT-GOBAIN ABRASIVES, INC. ,  SAINT-GOBAIN ABRASIFS

发明人： Paul W. REHRIG ,  Yinggang TIAN ,  Wei CHE ,  Arup K. KHAUND ,  Thomas PUTHANANGADY ,  Christopher ARCONA ,  Srinivasan RAMANATH

IPC分类号： B23D61/18 ,  B23D65/00 ,  B28D5/04 ,  B24D3/00 ,  B24D11/00

CPC分类号： B23D61/185 ,  B23D61/18 ,  B23D65/00 ,  B24D3/002 ,  B24D11/00 ,  B24D11/001 ,  B28D1/06 ,  B28D5/04 ,  B28D5/042 ,  B28D5/045

摘要： An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, a first type of abrasive particle overlying the tacking layer, a second type of abrasive particle different than the first type of abrasive particles overlying the tacking layer, and a bonding layer overlying at least a portion of one of the first type of abrasive particle and the second type of abrasive particle and the tacking layer.

摘要翻译： 一种磨料制品，包括具有细长体的衬底，覆盖衬底的粘合层，覆盖在粘合层上的第一类型磨料颗粒，与覆盖在粘合层上的第一类磨料颗粒不同的第二类磨料颗粒，以及 粘合层覆盖第一类型磨料颗粒和第二类磨料颗粒和粘合层中的至少一部分的至少一部分。

公开(公告)号：US09537292B2

公开(公告)日：2017-01-03

申请号：US13884515

申请日：2011-11-10

申请人： Conny Gustavsson ,  Hasse Hultman

发明人： Conny Gustavsson ,  Hasse Hultman

IPC分类号： E02F5/02 ,  H02G1/06 ,  E02F5/10 ,  E02F5/12 ,  E02F9/24 ,  G02B6/50 ,  H02G9/06 ,  B23D59/00 ,  B23D61/18 ,  F16L1/032 ,  G05D3/10 ,  E02F5/08 ,  E02F5/00 ,  F16L1/028

CPC分类号： E01C23/09 ,  B23D59/001 ,  B23D59/008 ,  B23D61/025 ,  B23D61/18 ,  B28D1/045 ,  B28D7/005 ,  E02D27/46 ,  E02F5/00 ,  E02F5/08 ,  E02F5/10 ,  E02F5/101 ,  E02F5/12 ,  E02F5/18 ,  E02F9/245 ,  F16L1/028 ,  F16L1/032 ,  G02B6/504 ,  G05D3/10 ,  H02G1/06 ,  H02G9/06 ,  Y10T83/175 ,  Y10T83/849 ,  Y10T83/852 ,  Y10T83/866 ,  Y10T83/929 ,  Y10T83/9457

摘要： The present invention relates to a method for placing at least one duct/communication cable below a road surface in an area, said area comprising a first layer (L1 and a second layer (L2), said first layer (L1) being a road layer, such as asphalt or concrete, and said second layer (L2) being a bearing layer for said first layer (L1) and being located below said first layer (L1), said method comprising the steps of: cutting a micro trench in said area through said first layer (L1) into said second layer (L2); placing at least one duct/communication cable in said micro trench so that said at least one duct/communication cable is placed below said first layer (L1); and filling said micro trench so as to restore said road surface.

摘要翻译： 本发明涉及一种用于在区域中的至少一个管道/通信电缆下方布置路面的方法，所述区域包括第一层（L1和第二层（L2）），所述第一层（L1）是道路层 ，例如沥青或混凝土，所述第二层（L2）是用于所述第一层（L1）的轴承层，并且位于所述第一层（L1）的下方，所述方法包括以下步骤：切割所述区域中的微沟槽 通过所述第一层（L1）进入所述第二层（L2）;将至少一个管道/通信电缆放置在所​​述微沟槽中，使得所述至少一个管道/通信电缆放置在所​​述第一层（L1）的下方;以及填充所述 微沟槽，以恢复路面。

公开(公告)号：US09017147B2

公开(公告)日：2015-04-28

申请号：US13089478

申请日：2011-04-19

申请人： Michael R. Vindler ,  Ronald H. Lovett

发明人： Michael R. Vindler ,  Ronald H. Lovett

IPC分类号： B26D3/10 ,  B23D61/18 ,  B23D45/00 ,  B26D1/44 ,  G01N1/04 ,  G01N1/06 ,  G01N1/08

CPC分类号： B23D61/18 ,  B23D45/003 ,  B26D1/44 ,  B26D3/10 ,  G01N1/04 ,  G01N1/06 ,  G01N1/08 ,  Y10T83/02

摘要： A sampling device for removing a surface portion from a substrate. The device includes a frame structure and a cutter head assembly. The cutter head assembly includes a pivot body having a first end supported at a pivot point on the frame structure, and a cutter supported for rotation about a rotational axis at a second end of the pivot body. The cutter has a semi-ellipsoidal shape and a drive motor is operably connected to the cutter. The pivot point is located in spaced relation to the rotational axis. The cutter is operable to cut a surface portion of a substrate during pivotal movement about the pivot point.

摘要翻译： 一种用于从基板去除表面部分的取样装置。 该装置包括框架结构和刀头组件。 刀头组件包括枢转体，该枢转体具有支撑在框架结构上的枢转点处的第一端和用于在枢转体的第二端处围绕旋转轴线旋转的刀片。 切割器具有半椭圆形状，并且驱动马达可操作地连接到切割器。 枢轴点与旋转轴线间隔开。 切割器可操作以在围绕枢转点的枢转运动期间切割基底的表面部分。