Cutting wheel for glass substrate
    1.
    发明授权
    Cutting wheel for glass substrate 有权
    玻璃基板切割轮

    公开(公告)号:US08726777B2

    公开(公告)日:2014-05-20

    申请号:US11089126

    申请日:2005-03-24

    Inventor: Soung-Yeoul Eom

    Abstract: A cutting wheel is provided for cutting a liquid crystal panel. The cutting wheel is disc shaped and includes a plurality of grooves disposed along an edge of the cutting wheel and cutting portions formed between the grooves. A pattern having a predetermined period is formed by multiple grooves and cutting portions. The grooves in each period have the same or different widths and depths and the cutting portions have probe shapes or cutting blades of different lengths. The cutting wheel is applied to dummy areas of the glass substrates forming the liquid crystal panel.

    Abstract translation: 提供用于切割液晶面板的切割轮。 切割轮是盘形的,并且包括沿着切割轮的边缘设置的多个槽和形成在凹槽之间的切割部分。 具有预定周期的图案由多个凹槽和切割部分形成。 每个周期中的槽具有相同或不同的宽度和深度,并且切割部分具有不同长度的探针形状或切割刀片。 将切割轮施加到形成液晶面板的玻璃基板的虚拟区域。

    Apparatus for treating thin film and method of treating thin film
    2.
    发明申请
    Apparatus for treating thin film and method of treating thin film 审中-公开
    薄膜处理设备及薄膜处理方法

    公开(公告)号:US20060068121A1

    公开(公告)日:2006-03-30

    申请号:US11221007

    申请日:2005-08-24

    CPC classification number: C23C16/45519 C23C16/48

    Abstract: An apparatus for treating a thin film on a substrate includes a stage on which the substrate is disposed. A gas shield faces the substrate. An energy source irradiates a part of the substrate with light emitted therefrom through a retention space of the gas shield. A dispense unit includes a pin nozzle that injects a reaction gas towards the part of the substrate.

    Abstract translation: 用于处理基板上的薄膜的设备包括其上设置有基板的台。 气体屏蔽面对基板。 能量源通过气体保护罩的保留空间照射基板的一部分从其发出的光。 分配单元包括针对衬底的一部分注入反应气体的针喷嘴。

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