Abstract:
A cutting wheel is provided for cutting a liquid crystal panel. The cutting wheel is disc shaped and includes a plurality of grooves disposed along an edge of the cutting wheel and cutting portions formed between the grooves. A pattern having a predetermined period is formed by multiple grooves and cutting portions. The grooves in each period have the same or different widths and depths and the cutting portions have probe shapes or cutting blades of different lengths. The cutting wheel is applied to dummy areas of the glass substrates forming the liquid crystal panel.
Abstract:
An apparatus for treating a thin film on a substrate includes a stage on which the substrate is disposed. A gas shield faces the substrate. An energy source irradiates a part of the substrate with light emitted therefrom through a retention space of the gas shield. A dispense unit includes a pin nozzle that injects a reaction gas towards the part of the substrate.
Abstract:
A cutting wheel is provided for cutting a liquid crystal panel. The cutting wheel is disc shaped and includes a plurality of grooves disposed along an edge of the cutting wheel and cutting portions formed between the grooves. A pattern having a predetermined period is formed by multiple grooves and cutting portions. The grooves in each period have the same or different widths and depths and the cutting portions have probe shapes or cutting blades of different lengths. The cutting wheel is applied to dummy areas of the glass substrates forming the liquid crystal panel.