摘要:
A liquid discharge head substrate includes an electrode layer, which is electrically connected to an element that generates energy used for discharging a liquid and provided in an inner side of a region between a first face and a third face of a substrate, and a member made of resin which covers the electrode is provided in the region.
摘要:
Provided is a method for manufacturing an ejection element substrate which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, and a substrate having a supply port for supplying the liquid to the liquid flow channel, and further a filter structure formed in the bottom of the supply port, including: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face.
摘要:
A liquid discharge head substrate includes an electrode layer, which is electrically connected to an element that generates energy used for discharging a liquid and provided in an inner side of a region between a first face and a third face of a substrate, and a member made of resin which covers the electrode is provided in the region.
摘要:
A method for manufacturing an ejection element substrate, which is provided with a flow-channel-forming member having an ejection orifice for ejecting a liquid and a liquid flow channel that is communicated with the ejection orifice, a substrate having a supply port for supplying the liquid to the liquid flow channel, and a filter structure formed in the bottom of the supply port, includes: forming the supply port by forming a through-hole by etching the substrate from a second face of the substrate on the side opposite to a first face of the substrate, on which the flow-channel-forming member is disposed; providing a resinous protection film on the side face and the bottom of the supply port; and forming a minute opening in the resinous protection film in the bottom of the supply port by carrying out a laser processing from the side of the second face.
摘要:
A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.
摘要:
A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.
摘要:
A liquid ejection head body includes a substrate and a channel forming member arranged on the substrate. The channel forming member has a liquid ejection port for ejecting liquid and a liquid channel communicating with the liquid ejection port, while the substrate has an ejection energy generating element for generating energy for ejecting liquid at a first surface side and a liquid supply port for supplying liquid to the liquid channel in the inside. A conductive layer for electrically connecting the first surface side and a second surface side disposed opposite to the first surface side is arranged along the lateral surface of the liquid supply port.
摘要:
A liquid ejection head body includes a substrate and a channel forming member arranged on the substrate. The channel forming member has a liquid ejection port for ejecting liquid and a liquid channel communicating with the liquid ejection port, while the substrate has an ejection energy generating element for generating energy for ejecting liquid at a first surface side and a liquid supply port for supplying liquid to the liquid channel in the inside. A conductive layer for electrically connecting the first surface side and a second surface side disposed opposite to the first surface side is arranged along the lateral surface of the liquid supply port.
摘要:
A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.
摘要:
An inkjet head includes a recording element substrate for discharging ink, a supply port penetrating the recording element substrate and serving as an ink flow path, a protrusion formed at a position surrounding the supply port, projecting from one surface of the recording element substrate, and having a first metal layer at a distal end, and a supporting member having a second metal layer welded with the first metal layer and supporting the recording element substrate.