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公开(公告)号：US20080005442A1
公开(公告)日：2008-01-03
申请号：US11798489
申请日：2007-05-14
IPC分类号： G06F13/36
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统架构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。
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公开(公告)号：US20060282593A1
公开(公告)日：2006-12-14
申请号：US11506894
申请日：2006-08-21
IPC分类号： G06F13/00
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
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公开(公告)号：US6073229A
公开(公告)日：2000-06-06
申请号：US921463
申请日：1997-09-02
IPC分类号： G06F1/18 , G06F13/00 , G06F13/14 , G06F13/40 , G06F15/00 , G06F15/76 , G06F15/78 , H01R12/50 , H01R33/00 , H05K1/00 , H05K1/14 , H05K7/10 , H05K7/14 , H05K7/18 , H01R23/68
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R23/68 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445 , H05K1/0286 , H05K1/14
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统结构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。
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公开(公告)号：US07803020B2
公开(公告)日：2010-09-28
申请号：US11798489
申请日：2007-05-14
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统结构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。
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公开(公告)号：US20100323536A1
公开(公告)日：2010-12-23
申请号：US12853994
申请日：2010-08-10
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R12/737 , H05K1/0286 , H05K1/14 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统结构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。
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6.发明授权Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board 失效无源背板能够被配置为与可插拔CPU板的数据大小相对应的可变数据路径宽度
公开(公告)号：US5822551A
公开(公告)日：1998-10-13
申请号：US662278
申请日：1996-06-12
IPC分类号： G06F1/18 , G06F13/00 , G06F13/14 , G06F13/40 , G06F15/00 , G06F15/76 , G06F15/78 , H01R12/50 , H01R33/00 , H05K1/00 , H05K1/14 , H05K7/10 , H05K7/14 , H05K7/18
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R23/68 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445 , H05K1/0286 , H05K1/14
摘要： A computer system includes a first passive backplane having a local bus, a memory bus, and peripheral bus. The computer system includes a first printed circuit board having a microprocessor, and connected to the local bus and to the memory bus. The computer system includes a second printed circuit board having a memory and connected to the memory bus. The computer system also includes a third printed circuit board having a peripheral controller, and connected to the local bus and to the peripheral bus The disclosed computer system further includes a second backplane. The second backplane is connected to the first passive backplane through a connector, where at least one of the local and peripheral buses extends from the first passive backplane to the second backplane through the connector. The computer system also includes a plurality of peripheral slots located on the second backplane and connected to the peripheral bus.
摘要翻译： 计算机系统包括具有本地总线，存储器总线和外围总线的第一无源底板。 计算机系统包括具有微处理器并且连接到本地总线和存储器总线的第一印刷电路板。 计算机系统包括具有存储器并连接到存储器总线的第二印刷电路板。 计算机系统还包括具有外围控制器并连接到本地总线和外围总线的第三印刷电路板。所公开的计算机系统还包括第二背板。 第二背板通过连接器连接到第一无源底板，其中至少一个本地和外围总线通过连接器从第一无源底板延伸到第二背板。 计算机系统还包括位于第二背板上并连接到外围总线的多个外围槽。
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公开(公告)号：US5812797A
公开(公告)日：1998-09-22
申请号：US702195
申请日：1996-08-23
IPC分类号： G06F1/18 , G06F13/00 , G06F13/14 , G06F13/40 , G06F15/00 , G06F15/76 , G06F15/78 , H01R12/50 , H01R33/00 , H05K1/00 , H05K1/14 , H05K7/10 , H05K7/14 , H05K7/18 , G06F13/20
CPC分类号： G06F1/185 , G06F1/184 , G06F1/186 , G06F13/4045 , G06F13/409 , H01R12/57 , H01R12/58 , H01R23/68 , H05K7/1084 , H05K7/1441 , H05K7/1442 , H05K7/1444 , H05K7/1445 , H05K1/0286 , H05K1/14
摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统结构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。
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