公开(公告)号：US20140138425A1

公开(公告)日：2014-05-22

申请号：US14117895

申请日：2012-05-15

申请人： Stefan Meyer ,  Hilmar Von Campe ,  Stephan Huber ,  Sven BOHME

发明人： Stefan Meyer ,  Hilmar Von Campe ,  Stephan Huber ,  Sven BOHME

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/80 ,  B23K1/0012 ,  B23K1/06 ,  B23K20/10

摘要： The invention relates to a method for the cohesive connection of a first element (16, 18) to a second element (10), wherein the elements are located one on the other during the connection process and are connected by means of a solder material which is subjected to ultrasonic vibrations during connection by means of a tool (32, 34). In order to allow cohesive connection in an energy-efficient manner, it is proposed that the first element (16, 18) used is one which has through-passage openings (28, 30), that for the purpose of connection the first element and the second element (10) are placed one on the other with through-passage openings open towards the second element, and that molten solder material is located in the through-passage openings during connection and in the through-passage openings the molten solder material is subjected to the ultrasonic vibrations.

摘要翻译： 本发明涉及一种用于将第一元件（16,18）与第二元件（10）的内聚连接的方法，其中在连接过程期间元件彼此位于另一元件上并且通过焊料材料连接 在连接期间通过工具（32,34）经受超声波振动。 为了以能量有效的方式允许内聚连接，提出使用的第一元件（16,18）是具有通过通道开口（28,30）的元件，为了连接第一元件和 第二元件（10）一个放置在另一个上，具有朝向第二元件开口的通道开口，并且熔融焊料材料在连接期间位于通道开口中，并且在通孔中，熔融焊料是 经受超声波振动。