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公开(公告)号：US20130171405A1
公开(公告)日：2013-07-04
申请号：US13338844
申请日：2011-12-28
CPC分类号： H01B1/02 , C09D7/61 , C09D7/70 , C23C2/04 , C23C4/06 , C23C24/00 , C23C30/00 , Y10T428/239 , Y10T428/31678
摘要： A method of obstructing metal whisker growth that includes providing a conductive structure comprised of a whisker forming metal, and forming a composite coating on the whisker forming metal. The composite coating may include a matrix phase of a polymer and a dispersed phase of reinforcing particles. The reinforcing particles are incorporated into the polymer to provide the composite coating with mechanical properties that obstruct whiskers from penetrating through the composite coating.
摘要翻译： 一种阻碍金属晶须生长的方法，其包括提供由晶须形成金属构成的导电结构，以及在晶须形成金属上形成复合涂层。 复合涂层可以包括聚合物的基体相和增强颗粒的分散相。 将增强颗粒结合到聚合物中以为复合涂层提供阻碍晶须穿透复合涂层的机械性能。
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公开(公告)号：US20090116198A1
公开(公告)日：2009-05-07
申请号：US11982630
申请日：2007-11-02
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/4275 , H01L2023/4056 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.
摘要翻译： 本发明一般涉及从电路板部件的散热，更具体地说，涉及改进安装在电气布线板上的电路板组件的热管理。 该结构包括散热器; 以及与所述散热器热接触地配置的辅助散热器和布线板上的电路板部件，所述辅助散热器具有位于所述辅助散热器的中心部分中的多个狭槽，其中所述辅助散热器都是 与散热器和电路板部件兼容地机械地兼容并导热。
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公开(公告)号：US07808789B2
公开(公告)日：2010-10-05
申请号：US11982630
申请日：2007-11-02
CPC分类号： H01L23/42 , H01L23/4275 , H01L2023/4056 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention relates generally to heat removal from circuit board components and, more specifically, to improved thermal management for circuit board components mounted on electrical wiring boards. The structure comprises a heat sink; and an auxiliary heat sink positioned in thermal contact with the heat sink and a circuit board component on a wiring board, the auxiliary heat sink having a plurality of slots located in a central portion of the auxiliary heat sink, wherein the auxiliary heat sink is both mechanically compliant and thermally conductive with both the heat sink and the circuit board component.
摘要翻译： 本发明一般涉及从电路板部件的散热，更具体地说，涉及改进安装在电气布线板上的电路板组件的热管理。 该结构包括散热器; 以及与所述散热器热接触地配置的辅助散热器和布线板上的电路板部件，所述辅助散热器具有位于所述辅助散热器的中心部分中的多个狭槽，其中所述辅助散热器都是 与散热器和电路板部件兼容地机械地兼容并导热。
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