公开(公告)号：US20060185144A1

公开(公告)日：2006-08-24

申请号：US11360292

申请日：2006-02-23

申请人： Stephan Wenke ,  Andreas Klocke ,  Boris Heuer

发明人： Stephan Wenke ,  Andreas Klocke ,  Boris Heuer

IPC分类号： B23P21/00

CPC分类号： B23Q17/2216 ,  Y10T29/5191 ,  Y10T409/303752 ,  Y10T409/309408

摘要： A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.

公开(公告)号：US07559152B2

公开(公告)日：2009-07-14

申请号：US11360292

申请日：2006-02-23

申请人： Stephan Wenke ,  Andreas Klocke ,  Boris Heuer

发明人： Stephan Wenke ,  Andreas Klocke ,  Boris Heuer

IPC分类号： B27G23/00

CPC分类号： B23Q17/2216 ,  Y10T29/5191 ,  Y10T409/303752 ,  Y10T409/309408

摘要： A method for determining the position of a milling tool for micro-structuring a substrate relative to a machining head, the machining head including a tool holder securing the milling tool, includes placing the milling tool against a reference surface of the substrate, opening the tool holder to enable an axial mobility of the milling tool relative to the machining head, and moving the machining head relative to the reference surface until a predetermined distance between the machining head and the reference surface is reached.

摘要翻译： 一种用于确定用于相对于加工头微结构化基板的铣刀的位置的方法，所述加工头包括固定所述铣刀的刀架，所述加工头包括将所述铣刀放置在所述基底的参考表面上，打开所述刀具 以使得铣刀相对于加工头的轴向移动，以及相对于参考表面移动加工头，直到达到加工头和参考表面之间的预定距离。

公开(公告)号：US07415927B2

公开(公告)日：2008-08-26

申请号：US11188431

申请日：2005-07-25

申请人： Stephan Wenke

发明人： Stephan Wenke

IPC分类号： B41C1/14

CPC分类号： H05K3/1225 ,  B41C1/145 ,  H05K2203/0169 ,  H05K2203/107 ,  Y10S430/146

摘要： A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.

摘要翻译： 一种用于通过激光形成印刷模版形式的衬底中的预定位置的开口的方法，其中使用夹紧装置以张紧框架的形式定位衬底。 在该过程中，通过首先确定中心参考点的坐标来防止由后续处理步骤导致的开口的位置偏移并导致基板的应力改变状态。 然后，确定开口与该参考点的预定位置的相应距离，并且从其确定优先顺序。 该优先级顺序形成了加工程序的基础，该加工程序控制激光头的运动路径并在基板中形成开口。

公开(公告)号：US20060021528A1

公开(公告)日：2006-02-02

申请号：US11188431

申请日：2005-07-25

申请人： Stephan Wenke

发明人： Stephan Wenke

IPC分类号： B41C1/14

CPC分类号： H05K3/1225 ,  B41C1/145 ,  H05K2203/0169 ,  H05K2203/107 ,  Y10S430/146

摘要： A method for forming openings of predetermined position in a substrate in the form of a printing stencil by means of a laser, wherein the substrate is positioned using a fixture means in the form of a tensioning frame. In the process, a shift in position of openings resulting from subsequent processing steps and leading to a changed state of stress of the substrate is prevented by first determining the coordinates of a central reference point. Then, the respective distances of the predetermined positions of the openings from this reference point are determined, and an order of priority is determined therefrom. This order of priority then forms the basis for a machining program, which controls the path of movement of the laser head and forms the openings in the substrate.

摘要翻译： 一种用于通过激光形成印刷模版形式的衬底中的预定位置的开口的方法，其中使用夹紧装置以张紧框架的形式定位衬底。 在该过程中，通过首先确定中心参考点的坐标来防止由后续处理步骤导致的开口的位置偏移并导致基板的应力改变状态。 然后，确定开口与该参考点的预定位置的相应距离，并且从其确定优先顺序。 该优先级顺序形成了加工程序的基础，该加工程序控制激光头的运动路径并在基板中形成开口。

公开(公告)号：US5630272A

公开(公告)日：1997-05-20

申请号：US551950

申请日：1995-11-02

申请人： Stephan Wenke

发明人： Stephan Wenke

IPC分类号： H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4053 ,  H05K2201/09981 ,  H05K2203/0126 ,  H05K2203/0753 ,  H05K2203/0763 ,  H05K2203/082 ,  H05K2203/1453 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the area beneath the holes (5) free, and conductive paste (10) is injected by a dispensing apparatus (8, 9) into the holes (5) in the circuit board (2) with the formation of marginal overlaps (12), such that a protruding, outwardly spreading plug (11) of conductive paste is formed. In accordance with the method, a cartridge needle (8) of the dispensing apparatus (8, 9) is placed against the circuit board (2) at the location of each hole (5) that is to be provided with a through-connection, and solderable conductive paste (10) is dispensed into the hole (5), after which the cartridge needle (8) is removed. A vacuum probe (9) of the dispensing apparatus (8, 9) then is placed against the circuit board (2) at the location of the hole (5), and the conductive paste (10) is partially sucked up, such that the conductive paste (10) forms contacting marginal overlaps (12, 13) around each hole (5) on both sides of the circuit board (2) and a continuous layer of conductive paste (10) remains on inside walls of the holes (5) leaving the holes with a defined minimum hole diameter.

摘要翻译： 一种用于在多层印刷电路板（2）中的孔（5）中形成贯穿连接的方法和装置，其中电路板（2）放置在离开孔下面的区域的支撑框架（3）上 5）通过分配装置（8,9）将游离的导电浆料（10）注入到电路板（2）中的孔（5）中，形成边缘重叠（12），使得向外突出 形成导电糊的扩展插头（11）。 根据该方法，分配装置（8,9）的盒式针（8）在要设置有贯通连接的每个孔（5）的位置处抵靠电路板（2）放置， 并将可焊接的导电膏（10）分配到孔（5）中，然后移除盒式针（8）。 然后，分配装置（8,9）的真空探针（9）在孔（5）的位置处抵靠电路板（2）放置，并且导电浆料（10）被部分地吸入，使得 导电膏（10）在电路板（2）的两侧上围绕每个孔（5）形成接触边缘重叠（12,13），并且连续的导电膏（10）层保留在孔（5）的内壁上， 留下具有限定的最小孔直径的孔。