公开(公告)号：US20120091188A1

公开(公告)日：2012-04-19

申请号：US13377587

申请日：2010-06-09

申请人： Bassem Elhage

发明人： Bassem Elhage

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： H05K3/3447 ,  B23K3/0607 ,  H05K3/3468 ,  H05K2203/0195 ,  H05K2203/0763

摘要： Solder pot intended for a machine for selective soldering of through-hole electronic components on a printed circuit board, characterized in that it is in the form of a right prism, preferably with a hexagonal base.

摘要翻译： 用于选择性地焊接印刷电路板上的通孔电子部件的机器的焊盘，其特征在于其为右棱镜的形式，优选具有六边形基部。

公开(公告)号：US20110284619A1

公开(公告)日：2011-11-24

申请号：US13142419

申请日：2009-12-28

申请人： Issaku Sato ,  Akira Takaguchi

发明人： Issaku Sato ,  Akira Takaguchi

IPC分类号： B23K3/06

CPC分类号： H05K3/3468 ,  B23K1/0016 ,  B23K1/085 ,  B23K3/0653 ,  H05K3/3447 ,  H05K2203/0763

摘要： To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder.By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a lead 31 of electronic component 30 being inserted into the insert hole 19a, it is possible to fill the through hole of the printed circuit board P with the molten solder 4, so that the reliability can be improved.

摘要翻译： 为了防止喷嘴中的堵塞而不使用任何惰性气体，并且通过用熔融焊料填充印刷电路板的通孔来允许提高可靠性。 通过将焊锡槽2中的熔融焊料4从内筒15的内部流入喷嘴盖19，喷嘴帽19的内部填充有熔融焊料4，并且填充喷嘴内部的熔融焊料4 帽19从内筒15和外筒16之间向下流动而基本上不从插入孔19a流到外部。 这使得熔融焊料4不会被氧化，因为熔融焊料4不暴露于外部空气。 因此，与现有的焊接装置同样，能够防止喷嘴3内的堵塞而不填充一部分惰性气体的喷嘴出口。 此外，由于电子部件30的引线31插入到插入孔19a中进行焊接，所以可以用熔融焊料4填充印刷电路板P的通孔，从而可以提高可靠性 。

公开(公告)号：US20060040517A1

公开(公告)日：2006-02-23

申请号：US11206181

申请日：2005-08-18

申请人： Shunji Taga ,  Kazuhiro Nakanishi

发明人： Shunji Taga ,  Kazuhiro Nakanishi

IPC分类号： H01R12/00

CPC分类号： H05K3/3468 ,  H01R9/2466 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2203/0557 ,  H05K2203/0746 ,  H05K2203/0763 ,  H05K2203/1476 ,  H05K2203/1572

摘要： A printed board is arranged above solder blowing nozzles of a spot flow soldering apparatus with first terminal groups facing upward, second terminal groups projected toward the solder blowing nozzles are shielded by shield jigs, solder jetted from the solder blowing nozzles solders soldered portion of the first terminal groups to a first conductor on a back side of the printed board, then the printed board is turned upside down to put the second terminal groups in an upward facing state and to use a jig to shield the first terminal groups facing downward, and solder jetted from the solder blowing nozzles solders soldered portion of the second terminal groups to a second conductor on a front side of the printed board.

摘要翻译： 印刷电路板布置在点焊装置的焊料喷嘴上方，其第一端子组面向上，向焊料喷嘴喷射的第二端子被屏蔽夹具屏蔽，从焊料喷嘴喷射的焊料第一焊料的焊料部分 端子组连接到印刷电路板的背侧上的第一导体，然后将印刷电路板上下颠倒以使第二端子组处于向上的状态，并使用夹具来屏蔽面向下的第一端子组，并且焊接 从焊料喷嘴喷射焊料将焊接的第二端子组的部分焊接到印刷电路板正面的第二导体。

公开(公告)号：US06305596B1

公开(公告)日：2001-10-23

申请号：US09220279

申请日：1998-12-23

申请人： Shui-Town Lin ,  Shih-Ren Chuang

发明人： Shui-Town Lin ,  Shih-Ren Chuang

IPC分类号： B23K3100

CPC分类号： H05K3/3468 ,  B23K1/012 ,  B23K2101/40 ,  H05K3/3447 ,  H05K2203/0763 ,  H05K2203/081

摘要： A method for breaking off solder bridges between pins of a through-hole component on a printed circuit board, comprises the following steps: (1) providing a soldering apparatus, the apparatus having an opening corresponding to the through-hole component, the opening defining an opening wall surface, providing a slit at a predetermined position of the opening wall surface; and (2) blowing a gas of a predetermined temperature and a predetermined pressure at a predetermined time to the position of the solder bridges through the slit for removing the solder bridges from the through-hole component.

摘要翻译： 一种用于断开印刷电路板上的通孔部件的销之间的焊桥的方法，包括以下步骤：（1）提供焊接装置，该装置具有与通孔部件相对应的开口，所述开口限定 开口壁表面，在开口壁表面的预定位置处设置狭缝; 以及（2）将预定温度和预定压力的气体在预定时间吹到所述焊料桥的位置穿过所述狭缝，以从所述通孔部件移除所述焊接桥。

公开(公告)号：US5630272A

公开(公告)日：1997-05-20

申请号：US551950

申请日：1995-11-02

申请人： Stephan Wenke

发明人： Stephan Wenke

IPC分类号： H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/4053 ,  H05K2201/09981 ,  H05K2203/0126 ,  H05K2203/0753 ,  H05K2203/0763 ,  H05K2203/082 ,  H05K2203/1453 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A method and apparatus for creating through-connections in holes (5) in multi-layer printed circuit boards (2), in which the circuit board (2) is laid on a supporting frame (3) which leaves the area beneath the holes (5) free, and conductive paste (10) is injected by a dispensing apparatus (8, 9) into the holes (5) in the circuit board (2) with the formation of marginal overlaps (12), such that a protruding, outwardly spreading plug (11) of conductive paste is formed. In accordance with the method, a cartridge needle (8) of the dispensing apparatus (8, 9) is placed against the circuit board (2) at the location of each hole (5) that is to be provided with a through-connection, and solderable conductive paste (10) is dispensed into the hole (5), after which the cartridge needle (8) is removed. A vacuum probe (9) of the dispensing apparatus (8, 9) then is placed against the circuit board (2) at the location of the hole (5), and the conductive paste (10) is partially sucked up, such that the conductive paste (10) forms contacting marginal overlaps (12, 13) around each hole (5) on both sides of the circuit board (2) and a continuous layer of conductive paste (10) remains on inside walls of the holes (5) leaving the holes with a defined minimum hole diameter.

摘要翻译： 一种用于在多层印刷电路板（2）中的孔（5）中形成贯穿连接的方法和装置，其中电路板（2）放置在离开孔下面的区域的支撑框架（3）上 5）通过分配装置（8,9）将游离的导电浆料（10）注入到电路板（2）中的孔（5）中，形成边缘重叠（12），使得向外突出 形成导电糊的扩展插头（11）。 根据该方法，分配装置（8,9）的盒式针（8）在要设置有贯通连接的每个孔（5）的位置处抵靠电路板（2）放置， 并将可焊接的导电膏（10）分配到孔（5）中，然后移除盒式针（8）。 然后，分配装置（8,9）的真空探针（9）在孔（5）的位置处抵靠电路板（2）放置，并且导电浆料（10）被部分地吸入，使得 导电膏（10）在电路板（2）的两侧上围绕每个孔（5）形成接触边缘重叠（12,13），并且连续的导电膏（10）层保留在孔（5）的内壁上， 留下具有限定的最小孔直径的孔。

公开(公告)号：US4911796A

公开(公告)日：1990-03-27

申请号：US172199

申请日：1988-03-23

申请人： Ronald G. Reed

发明人： Ronald G. Reed

IPC分类号： H05K3/00 ,  H05K3/06 ,  H05K3/42

CPC分类号： H05K3/0008 ,  H05K3/061 ,  H05K2201/0355 ,  H05K2201/0959 ,  H05K2201/09981 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/0191 ,  H05K2203/0554 ,  H05K2203/0763 ,  H05K2203/082 ,  H05K3/0047 ,  H05K3/424 ,  H05K3/427

摘要： A process of forming plates through-holes in a printed circuit board involves placing a film of fluid ink having electrically conductive properties on a side wall of the hole, curing the film to a solid and electroplating a layer of metal on the conductive ink film. The conductive ink preferably is a composition including conductive particles such as carbon and silver flakes. The ink also preferably includes a thermosetting or radiation curable binder and a thinner. The film of ink is cured before the layer of metal is electroplated thereon. The plated through-hole is protected from the etchant when the conductors are etched by placing a radiation curable putty material into the hole, curing it, and then depositing a layer of resist on top of the cured putty and a conductive sheet clad to the substrate of the circuit board.

摘要翻译： 在印刷电路板中形成板通孔的工艺包括将具有导电性能的流体油墨膜放置在孔的侧壁上，将该膜固化并在导电油墨膜上电镀一层金属。 导电油墨优选是包含导电颗粒如碳和银薄片的组合物。 油墨还优选包含热固性或可辐射固化的粘合剂和稀释剂。 在金属层电镀之前，油墨膜被固化。 当通过将放射线可固化的油灰材料放入孔中进行蚀刻，使其固化，然后在固化的油灰的顶部上沉积抗蚀剂层，并将覆盖在基底上的导电片 的电路板。

公开(公告)号：US4383495A

公开(公告)日：1983-05-17

申请号：US390579

申请日：1982-06-21

申请人： George J. Plichta ,  Thomas E. Unger

发明人： George J. Plichta ,  Thomas E. Unger

IPC分类号： H05K1/05 ,  H05K1/09 ,  H05K3/12 ,  H05K3/40 ,  H05K3/42

CPC分类号： H05K3/4053 ,  H05K3/403 ,  H05K1/056 ,  H05K1/095 ,  H05K2201/09154 ,  H05K2201/09981 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/0709 ,  H05K2203/0763 ,  H05K3/1216

摘要： The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a length no greater than the thickness of the substrate 12. After ink 24 has been applied to the top surface of the substrate, the inserted fingers 22 are withdrawn, thereby drawing the ink down into the thru holes and coating the walls 41. In another embodiment, fingers 62 are aligned with selected portions 52 of an edge 55 of the substrate 50 to coat the portions of the edge as the fingers are moved by the edge after the heads of the fingers have been coated with the ink 24.

摘要翻译： 印刷线路板基板12中的通孔11的壁41（图4）通过将指状物22插入通孔中而涂覆有液体24。 每个指状物的直径略小于相关通孔的直径，并且具有不大于基底12的厚度的长度。在将墨24施加到基底的顶表面之后，插入的指状物22是 抽出，从而将墨水向下拉入通孔并涂覆壁41.在另一个实施例中，指状物62与衬底50的边缘55的选定部分52对齐，以在手指移动时涂覆边缘的部分 在手指的头部之后的边缘已经涂覆有墨水24。

公开(公告)号：US3261769A

公开(公告)日：1966-07-19

申请号：US22067262

申请日：1962-08-31

申请人： PHILIPS CORP

发明人： THOMAS COE ,  DE KERKHOF CORNELIS MARINUS VA

IPC分类号： C25D7/00 ,  H05K3/00 ,  H05K3/24 ,  H05K3/42

CPC分类号： H05K3/423 ,  C25D7/00 ,  H05K3/0088 ,  H05K3/242 ,  H05K3/245 ,  H05K3/424 ,  H05K3/428 ,  H05K2203/0557 ,  H05K2203/0763

公开(公告)号：US08685202B2

公开(公告)日：2014-04-01

申请号：US13087390

申请日：2011-04-15

申请人： Yao-Wen Bai

发明人： Yao-Wen Bai

IPC分类号： C23F1/00

CPC分类号： H05K3/429 ,  H05K1/0251 ,  H05K3/0088 ,  H05K3/068 ,  H05K2203/0763

摘要： In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed.

摘要翻译： 在制造印刷电路板的方法中，提供了包括多个电镀通孔（PTH）的基板。 每个PTH具有在其内壁上电镀的导电层，并且包括电连接部分和短截线。 在与基座相邻的基板的表面上形成保护层。 提供了一种蚀刻装置，包括对应于PTH的上板和多个喷管。 每个喷射管包括超过上板的突出部分。 衬底被布置成使得保护层与上板接触并且突出部分被接收在短截线中。 之后，突出部分喷涂蚀刻剂以蚀刻并去除短截线的导电层，并且去除保护层。

公开(公告)号：US08403199B2

公开(公告)日：2013-03-26

申请号：US13257936

申请日：2010-03-24

申请人： Issaku Sato ,  Akira Takaguchi

发明人： Issaku Sato ,  Akira Takaguchi

IPC分类号： B23K3/06 ,  B23K31/02

CPC分类号： B23K3/0653 ,  B23K1/085 ,  B23K2101/42 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2203/0746 ,  H05K2203/0763

摘要： To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath.As shown in FIG. 3, an automatic partial-jet-soldering apparatus 100 is provided with a solder bath 4 that has a nozzle base portion 44 and contains molten solder 7, a pump 5 that supplies the molten solder 7 contained in the solder bath 4 under a predetermined pressure to the nozzle base portion 44, plural nozzles 8a and the like that have predetermined solder-spouting areas and connect the nozzle base portion 44 to spout the molten solder 7 supplied from the pump 5 under the predetermined pressure so that it rises by its surface tension, and a dummy nozzle 32 that has a solder-spouting area more than that of any of the nozzles 8a and the like and connects the nozzle base portion 44 to spout the molten solder 7 supplied from the pump 5 under the predetermined pressure, wherein the dummy nozzle 32 is positioned on a position which is nearer the pump 5 than the nozzles 8a and the like.

摘要翻译： 为了使熔融焊料能够以稳定的状态部分地喷射到部件安装部件上，而不会减少难以设定喷射量的熔融焊料的泵的转数，即使使用具有小喷射口的喷嘴 部分喷射焊锡浴。 如图所示。 如图3所示，自动部分喷射焊接装置100设置有具有喷嘴基部44并且包含熔融焊料7的焊料槽4，将包含在焊料槽4中的熔融焊料7供给到预定压力的泵5 到喷嘴基部44，具有预定的焊料喷射区域的多个喷嘴8a等，并且连接喷嘴基部44以在预定压力下喷出从泵5供应的熔融焊料7，使得其以其表面张力 以及具有大于喷嘴8a等的焊料喷射面积的虚拟喷嘴32，并且连接喷嘴基部44以在预定压力下喷出从泵5供给的熔融焊料7，其中， 虚拟喷嘴32位于比喷嘴8a等靠近泵5的位置。