Reduced stress sputtering target and method of manufacturing therefor
    1.
    发明授权
    Reduced stress sputtering target and method of manufacturing therefor 失效
    减少应力溅射靶及其制造方法

    公开(公告)号:US5474667A

    公开(公告)日:1995-12-12

    申请号:US199627

    申请日:1994-02-22

    IPC分类号: C23C14/34 H01J37/34

    摘要: A sputtering target assembly in which the region of attachment between the sputtering target and the backing plate has varying stiffness, thereby reducing stresses in the target during sputtering. In the region of attachment, the backing plate has varying thickness, for example a smooth taper. Alternatively, the backing plate may include structures which affect the stiffness of the backing plate in the region of attachment. These structures may be defined by machining, molding or forging during manufacture of the backing plate, or by machining or drilling voids in the backing plate. As a second alternative, the bonding material used to attach the sputtering target and the backing plate may have a varying stiffness across the region of attachment.

    摘要翻译: 溅射靶组件,其中溅射靶和背板之间的连接区域具有变化的刚度,从而在溅射期间降低靶中的应力。 在连接区域中,背板具有变化的厚度,例如平滑的锥度。 或者,背板可以包括在附接区域中影响背板的刚度的结构。 这些结构可以通过在背板的制造期间的机械加工,模制或锻造,或者通过机加工或钻出背板中的空隙来限定。 作为第二替代方案,用于附接溅射靶和背板的接合材料可以在连接区域上具有变化的刚度。

    Self aligning in-situ ellipsometer and method of using for process
monitoring
    2.
    发明授权
    Self aligning in-situ ellipsometer and method of using for process monitoring 失效
    自适应原位椭偏仪及其用于过程监控的方法

    公开(公告)号:US5408322A

    公开(公告)日:1995-04-18

    申请号:US52888

    申请日:1993-04-26

    CPC分类号: G01N21/211 G01B11/065

    摘要: An ellipsometric measuring system is set-up in association with a vacuum chamber on a production line for thin film samples. The ellipsometer has a scanner for directing the incident light beam to different locations on a thin film sample, and the ellipsometer also has an aperture for limiting the reflected light beam received by the photodetector. The scanner implements a method of aligning the incident beam to a selected surface of the sample. The scanner and the aperture are used to provide a finer adjustment of the incident beam with respect to the selected surface. The ellipsometric measuring system further uses test thin film samples with known film thicknesses and index or refractions to calculate a value for the angle of incidence of the incident light beam.

    摘要翻译: 椭圆测量系统与薄膜样品生产线上的真空室相关联地设置。 椭偏仪具有用于将入射光束引导到薄膜样品上的不同位置的扫描仪,并且椭偏仪还具有用于限制由光电检测器接收的反射光束的孔。 扫描器实现将入射光束与样品的选定表面对准的方法。 扫描器和孔径用于提供相对于所选择的表面的入射光束的更精细的调整。 椭圆测量系统还使用具有已知膜厚度和折射率或折射率的测试薄膜样品来计算入射光束入射角的值。