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公开(公告)号:US06434003B1
公开(公告)日:2002-08-13
申请号:US09840058
申请日:2001-04-24
IPC分类号: H05K720
CPC分类号: H05K7/20927
摘要: The present invention relates to a cold plate for cooling electronic components comprising a base having a top surface onto which at least one electronic component is to be placed; a cooling well formed in the top of the base and open at the top; a feed channel formed in the base for carrying fluid into the cooling well; a drain channel formed in the base for carrying cooling fluid away from the cooling well; cooling well inlets and outlets formed in the cooling well and in communication with the feed channel and drain channels, respectively. The feed and drain channels are sufficiently large relative to the size and flow characteristics of the well and cooling well inlets and outlets such that when the cooling fluid flows through the device, the pressure drop across the feed channel is substantially less than the pressure drop across the well.
摘要翻译: 本发明涉及一种用于冷却电子部件的冷板,包括:具有至少一个电子部件的顶表面的基座; 冷却井形成在基部的顶部并在顶部开口; 在基座中形成的用于将流体输送到冷却井中的进料通道; 形成在基座中的用于将冷却流体从冷却井运送的排水通道; 在冷却井中形成的冷却井入口和出口分别与进料通道和排放通道连通。 进料和排出通道相对于井和冷却井入口和出口的尺寸和流动特性足够大,使得当冷却流体流过装置时,跨进料通道的压降实质上小于 那个井