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公开(公告)号：US20080083436A1
公开(公告)日：2008-04-10
申请号：US11977972
申请日：2007-10-26
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
IPC分类号： B08B3/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20080047582A1
公开(公告)日：2008-02-28
申请号：US11977896
申请日：2007-10-26
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
IPC分类号： B08B6/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060266387A1
公开(公告)日：2006-11-30
申请号：US11497907
申请日：2006-08-01
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
IPC分类号： B08B3/02
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060260644A1
公开(公告)日：2006-11-23
申请号：US11497492
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
IPC分类号： B08B6/00
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060260642A1
公开(公告)日：2006-11-23
申请号：US11496895
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060278253A1
公开(公告)日：2006-12-14
申请号：US11497193
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060266392A1
公开(公告)日：2006-11-30
申请号：US11496828
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060260643A1
公开(公告)日：2006-11-23
申请号：US11497405
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20080083437A1
公开(公告)日：2008-04-10
申请号：US11977818
申请日：2007-10-26
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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公开(公告)号：US20060266393A1
公开(公告)日：2006-11-30
申请号：US11496935
申请日：2006-07-31
申请人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
发明人： Steven Verhaverbeke , J. Truman , Alexander Ko , Rick Endo
CPC分类号： H01L21/67051 , B08B3/02 , B08B3/12 , B08B2203/0288 , H01L21/02041 , Y10S134/902
摘要： An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
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