摘要:
An apparatus adapted to transmit and receive a packet between a network processor and a packet controller includes: the packet controller receiving an input packet from an input interface; a packet buffer storing and delivering the input packet the received input packet in response to a request from the network processor; a packet queue delivering information for the stored input packet from the packet controller to the network processor; and the network processor receiving a packet from the packet buffer and delivering the packet to an output interface using information for the input packet from the packet queue.
摘要:
A method for processing various numbers of ports in a network processor. A method for processing various numbers of ports in a network processor comprises the steps of: a) receiving the number N of ports from a system controller; b) allocating N−1 number of registers for storing N−1 number of port management information in response to the number N of ports; c) processing a packet by sequentially accessing the N number of ports; and d) after processing a packet related to a predetermined port, storing management information related to the predetermined port in a register used for the next port, and storing the management information related to the predetermined port in a first register among the N−1 number of registers when a register for storing management information in a previous packet processing is the last (N−1)-th register among the N−1 number of registers.
摘要:
Spin-coating apparatus for use in manufacturing a semiconductor device or the like and a method of operation of the apparatus prevent substrates from being positioned incorrectly in a process module of the apparatus. The spin-coating apparatus includes an image sensor that captures an image of the wafer in the process module, and a control unit that receives image data from the image sensor. The method includes loading a substrate onto a process module using an arm of a transfer device, capturing an image of the substrate using the image sensor, and comparing image data generated by the image sensor with a standard image data stored to determine an actual position of the substrate. If the substrate is incorrectly positioned, the operation of the arm of the transfer device is adjusted to compensate.
摘要:
A semiconductor device includes a through-silicon-via arranged to couple a plurality of stacked semiconductor chips, an interconnection line coupled to the through-silicon-via at one side and arranged to couple the through-silicon-via to the semiconductor chip, an internal interconnection line disposed at the other side of the interconnection line and intersected with the interconnection line, and at least one first contact disposed to couple the internal interconnection line to the interconnection line. A region of the interconnection line in which the internal interconnection line is disposed is equally divided, and an area between the divided regions is removed.
摘要:
A semiconductor device includes a through-silicon-via arranged to couple a plurality of stacked semiconductor chips, an interconnection line coupled to the through-silicon-via at one side and arranged to couple the through-silicon-via to the semiconductor chip, an internal interconnection line disposed at the other side of the interconnection line and intersected with the interconnection line, and at least one first contact disposed to couple the internal interconnection line to the interconnection line. A region of the interconnection line in which the internal interconnection line is disposed is equally divided, and an area between the divided regions is removed.