FLASH MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    FLASH MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    闪存存储器件及其制造方法

    公开(公告)号:US20080123433A1

    公开(公告)日:2008-05-29

    申请号:US11946721

    申请日:2007-11-28

    IPC分类号: G11C11/34

    摘要: A flash memory device is disclosed. The flash memory device includes a substrate, a memory cell transistor and a selection transistor. The substrate has a first region where the memory cell transistor is to be formed and a second region where the selection transistor is to be formed. The first region has an upper surface located within a first plane and the second region has an upper surface located within a second plane different from the first plane. The memory cell transistors may have a Fin-FET structure. The flash memory device may prevent a disturbance phenomenon in which an electron-hole pair infiltrates the memory cell transistor caused by a high integration degree of the flash memory device.

    摘要翻译: 公开了一种闪存器件。 闪存器件包括衬底,存储单元晶体管和选择晶体管。 衬底具有要形成存储单元晶体管的第一区域和要形成选择晶体管的第二区域。 第一区域具有位于第一平面内的上表面,而第二区域具有位于不同于第一平面的第二平面内的上表面。 存储单元晶体管可以具有Fin-FET结构。 闪速存储器件可以防止由闪存器件的高集成度引起的电子 - 空穴对侵入存储单元晶体管的干扰现象。

    METHOD OF MANUFACTURING NON-VOLATILE MEMORY DEVICE
    2.
    发明申请
    METHOD OF MANUFACTURING NON-VOLATILE MEMORY DEVICE 有权
    制造非易失性存储器件的方法

    公开(公告)号:US20120015512A1

    公开(公告)日:2012-01-19

    申请号:US13238084

    申请日:2011-09-21

    IPC分类号: H01L21/28

    CPC分类号: H01L27/11568

    摘要: A non-volatile memory device includes field insulating layer patterns on a substrate to define an active region of the substrate, upper portions of the field insulating layer patterns protruding above an upper surface of the substrate, a tunnel insulating layer on the active region, a charge trapping layer on the tunnel insulating layer, a blocking layer on the charge trapping layer, first insulating layers on upper surfaces of the field insulating layer patterns, and a word line structure on the blocking layer and first insulating layers.

    摘要翻译: 非易失性存储器件包括在衬底上的场绝缘层图案,以限定衬底的有源区,场绝缘层图案的上部突出在衬底的上表面上,在有源区上的隧道绝缘层, 隧道绝缘层上的电荷俘获层,电荷俘获层上的阻挡层,场绝缘层图案的上表面上的第一绝缘层,以及阻挡层和第一绝缘层上的字线结构。