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公开(公告)号：US11841279B2
公开(公告)日：2023-12-12
申请号：US17089077
申请日：2020-11-04
发明人： Donald J. Russell , David Serrell
摘要： Described is a calorimeter that includes a thermal column, a sample container, a reference container, a thermal shield, a diffusion-bonded block and a thermal plate. One or more heat flux sensors are disposed between the thermal column and the sample container and between the thermal column and the reference container. The thermal shield is in thermal communication with the thermal column and is separated from and substantially encloses the sample container, reference container and thermal column. The diffusion-bonded block includes a first metallic layer having a first thermal conductivity, a second metallic layer having a second thermal conductivity and a third metallic layer having a third thermal conductivity. The second thermal conductivity is different from the first and third thermal conductivities. The first metallic layer is in thermal communication with the base of the thermal column and the third metallic layer is in thermal communication with the thermal plate.
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公开(公告)号：US20210156750A1
公开(公告)日：2021-05-27
申请号：US17089077
申请日：2020-11-04
发明人： Donald J. Russell , David Serrell
摘要： Described is a calorimeter that includes a thermal column, a sample container, a reference container, a thermal shield, a diffusion-bonded block and a thermal plate. One or more heat flux sensors are disposed between the thermal column and the sample container and between the thermal column and the reference container. The thermal shield is in thermal communication with the thermal column and is separated from and substantially encloses the sample container, reference container and thermal column. The diffusion-bonded block includes a first metallic layer having a first thermal conductivity, a second metallic layer having a second thermal conductivity and a third metallic layer having a third thermal conductivity. The second thermal conductivity is different from the first and third thermal conductivities. The first metallic layer is in thermal communication with the base of the thermal column and the third metallic layer is in thermal communication with the thermal plate.
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