公开(公告)号：US20150194553A1

公开(公告)日：2015-07-09

申请号：US14150101

申请日：2014-01-08

Applicant: TAIFLEX SCIENTIFIC CO., LTD.

Inventor： FU-MIN WANG ,  I-LING TENG ,  TSUNG-TAI HUNG ,  YU-HSIEN LEE ,  TZU-CHING HUNG ,  CHEN-HSIN HUANG

IPC: H01L31/048

CPC classification number: H01L31/0481 ,  B32B17/10018 ,  B32B17/10642 ,  B32B17/10788 ,  B32B27/08 ,  B32B27/18 ,  B32B27/283 ,  B32B27/306 ,  B32B27/308 ,  B32B27/32 ,  B32B27/40 ,  B32B2264/10 ,  B32B2307/302 ,  B32B2367/00 ,  B32B2457/12 ,  H01L31/048 ,  H01L31/049 ,  H02S40/42 ,  Y02E10/50

Abstract: A thermally conductive encapsulate comprising a thermally conductive composite layer having a thermal conductivity of 0.5 W/m*K to 8 W/m*K and an adhesive resin layer having a thermal conductivity of 0.05 W/m*K to 0.4 W/m*K is provided. A percentage of a thickness of the adhesive resin layer relative to a total thickness of the thermally conductive encapsulate ranges from 0.1% to 10%, and the thermally conductive encapsulate has an overall thermal impedance less than 0.72° C.-in2/W. Accordingly, the thermally conductive encapsulate not only provides sealing, insulating and adhesive properties, but also effectively dissipates the heat to the environment without increasing the thickness or volume of the solar cell module and without modifying the original encapsulation process, and thereby enhancing the solar cell module's conversion efficiency and increasing its power output.

Abstract translation: 一种导热封装体，其特征在于，具有热传导率为0.5W / m·K〜8W / m·K的导热性复合层，导热率为0.05W / m·K〜0.4W / m * 提供K。 粘合树脂层的厚度相对于导热封装的总厚度的百分比为0.1％〜10％，导热性封装的总热阻抗小于0.72℃/ in2 / W。 因此，导热封装不仅提供了密封，绝缘和粘合性能，而且还有效地将热量散发到环境中，而不增加太阳能电池模块的厚度或体积，而不改变原来的封装工艺，从而增强太阳能电池 模块的转换效率并增加其功率输出。